Skills
- circuit board
- tool development
- failure analysis
- microscopy
- X-section
- planar
- polishing
- material analysis
- SEM
- imaging
Job Description
The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
**Must be able to stand and perform work for 6 hours.
Minimum qualification is an AA degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development.
Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM imaging on printed circuit board are preferred.
Knowledge of packaging material property and behavior is beneficial.
Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized.