Overview
On Site
Hybrid
Depends on Experience
Full Time
Accepts corp to corp applications
Skills
Power Integrity
Multiphysics
Signal
Job Details
Required Qualifications
- BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
- 8+ years (Senior) / 12+ years (Principal) of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
- Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
- Proven ability to extract/package-level models (RLC, S-parameters, dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
- Demonstrated experience creating and validating PDK/ADK simulation collateral spanning SI/PI, RF, thermal, and mechanical domains.
- Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
- Startup DNA. You re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
- Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
- Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30 50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.
Preferred Qualifications
- MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
- Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
- Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.
- Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.
- Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.
- Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.
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