Sr. Mechanical Engineer (from Semiconductor industry)


On Site
Depends on Experience
Contract - W2
Contract - 6 Month(s)
No Travel Required


Mechanical Design
mechanical engineer
Capital equipment
precision machine design
design for stiffness
controlling degrees of freedom
error budgeting
sensor section
material selection
motion systems
machine vision
vacuum systems
wafer handling
charged particle system
additive manufacturing methods
joining techniques

Job Details

Job Title: Sr. Mechanical Engineer (2 Spots) - Coming from Semiconductor with either Capital, or Metrology, or other equipment within semiconductor industry background

Location: Hillsboro, Oregon - ONSITE
Length of Assignment: 6 MONTHS

Hours: 40 hours per week

Estimated Start date: July 8th

Background Check/Drug Screen - Both Required


Contribute to the hardware development of highly customized, multi-million-dollar microscopes with sub-nanometer resolution by working closely with, and learning from, world class Marketing, Project Management, Operations, suppliers, and engineers and scientists of a diverse set of backgrounds. Mechanical development from requirements to production release with concept layout, detailed design, analysis and testing as appropriate Provide solutions to improve component and assembly level COGS and Design for manufacturing efforts Make and meet project cost, quality and schedule work you're doing Provide mechanical scoping and guidance for new projects, NSR s and potential portfolio changes Support release to production. Provide innovative solutions to design challenges

Skills Required

5+ yrs of Mech Eng exp leading the development of complex capital, and/or metrology, equipment in the semi-conductor is a MUST

Precision machine design proficiency, design for stiffness, controlling degrees of freedom, error budgeting, sensor selection, material selection, GD&T, design for manufacturability is a MUST

Bachelor s Degree in Mechanical Engineering


Exp with metrology, motion systems, machine vision, vacuum systems, ceramics, high voltage, wafer handling, automation and/or charged particle system PREFERRED /

Exp with Traditional and additive manufacturing methods and joining techniques (welding, brazing, ) PREFERRED

Proficiency with CAE PREFFERED

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