Overview
On Site
USD 127,200.00 - 190,800.00 per year
Full Time
Skills
Packaging Engineering
Conceptual Design
Product Packaging
Manufacturing
New Product Introduction
Interfaces
IP
Intellectual Property
Test Equipment
Data Analysis
Process Engineering
JEDEC
IPC
Materials Science
POP
FC
Statistics
JMP
Conflict Resolution
Problem Solving
Project Management
Systems Design
Product Design
Layout
Physics
DV
Computer Hardware
Forms
Assembly
SIP
Optimization
Testing
Failure Analysis
ROOT
SMT
Laboratory Equipment
Analytical Skill
Metrology
DRM
Internal Communications
Integrated Circuit
IC
Collaboration
NPI
Supervision
Decision-making
Communication
Negotiations
Packaging Design
Chemical Engineering
Electrical Engineering
Mechanical Engineering
Recruiting
Policies and Procedures
Law
Sales
Job Details
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
As a Qualcomm Package System Design and Technology Engineer, you will drive new advanced package technology development, concept design architecture analysis from package to system, new generation product package structure selection, package system design by multi-physics simulation analysis, multi-physics lab validation/correlation of package to system models, and the manufacturing qualification for new product introduction (NPI). Package System Design and Technology Engineers collaborate with multi-disciplinary teams to achieve optimized performance of mechanical, electrical, and thermal package systems for various end market applications. This role interfaces with internal/external IP teams, industry standards, and vendors to set package to system design and technology specifications; enabling product designs to achieve high performance, high reliability, low cost, and easy to implement system with integrated component attaches for end customers.
Ideal Candidate will have:
Bachelor's degree in Mechanical Engineering, Material Science or related field and 1+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Mechanical Engineering, Material Science or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. OR PhD in Mechanical Engineering, Material Science or related field.
Hands on experience with mechanical test equipment and data analysis software.
Familiarity with SMT process development, reliability testing, and industry standards such as JEDEC/IPC.
Preferred Qualifications:
Master's Degree in Mechanical Engineering, Material Science or related field.
3+ years of System/Package Design/Technology Engineering or related work experience.
Experience with advanced IC packaging technologies (e.g., PoP, FC-BGA, WLP).
Knowledge of solder alloy metallurgy and underfill material properties.
Skills in statistical analysis software (e.g., JMP, ReliaSoft).
Strong problem-solving and project management capabilities.
Ability to work in a fast-paced lab environment with occasional international collaboration.
Principal Duties and Responsibilities:
Applies Package System Design and Technology knowledge to drive package product design layout, design multi-physics optimizations, design verification (DV), and physical hardware Module/SiP for all forms of bare silicon products (single or multi-die).
Performs SMT assembly evaluations for advanced IC packages and module/SIP, including stencil design, solder paste optimization and reflow profiling.
Performs empirical testing, on materials and devices, characterize mechanical performance, and analyze board/system level interactions.
Supports Failure analysis and root cause investigations for SMT and board level reliability (BLR) related defects.
Maintains and operates lab equipment (reflow ovens, thermal cycling chambers, mechanical testers, analytical metrology equipment).
Document and publish technical reports summarizing test results and recommendations.
Develops (structure/process/material/DRM), evaluates, and qualifies next-generation IC package technologies.
Collaborate with internal teams (Design, NPI, Quality) and external suppliers and customers to ensure alignment on reliability and process standards.
Level of Responsibility:
Works under supervision. Decision-making may affect work beyond immediate work group. Requires verbal and written communication skills to convey information. May require basic negotiation, influence, tact, etc.
Has a moderate amount of influence over key organizational decisions.
Minimum Qualifications:
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$127,200.00 - $190,800.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
As a Qualcomm Package System Design and Technology Engineer, you will drive new advanced package technology development, concept design architecture analysis from package to system, new generation product package structure selection, package system design by multi-physics simulation analysis, multi-physics lab validation/correlation of package to system models, and the manufacturing qualification for new product introduction (NPI). Package System Design and Technology Engineers collaborate with multi-disciplinary teams to achieve optimized performance of mechanical, electrical, and thermal package systems for various end market applications. This role interfaces with internal/external IP teams, industry standards, and vendors to set package to system design and technology specifications; enabling product designs to achieve high performance, high reliability, low cost, and easy to implement system with integrated component attaches for end customers.
Ideal Candidate will have:
Bachelor's degree in Mechanical Engineering, Material Science or related field and 1+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Mechanical Engineering, Material Science or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. OR PhD in Mechanical Engineering, Material Science or related field.
Hands on experience with mechanical test equipment and data analysis software.
Familiarity with SMT process development, reliability testing, and industry standards such as JEDEC/IPC.
Preferred Qualifications:
Master's Degree in Mechanical Engineering, Material Science or related field.
3+ years of System/Package Design/Technology Engineering or related work experience.
Experience with advanced IC packaging technologies (e.g., PoP, FC-BGA, WLP).
Knowledge of solder alloy metallurgy and underfill material properties.
Skills in statistical analysis software (e.g., JMP, ReliaSoft).
Strong problem-solving and project management capabilities.
Ability to work in a fast-paced lab environment with occasional international collaboration.
Principal Duties and Responsibilities:
Applies Package System Design and Technology knowledge to drive package product design layout, design multi-physics optimizations, design verification (DV), and physical hardware Module/SiP for all forms of bare silicon products (single or multi-die).
Performs SMT assembly evaluations for advanced IC packages and module/SIP, including stencil design, solder paste optimization and reflow profiling.
Performs empirical testing, on materials and devices, characterize mechanical performance, and analyze board/system level interactions.
Supports Failure analysis and root cause investigations for SMT and board level reliability (BLR) related defects.
Maintains and operates lab equipment (reflow ovens, thermal cycling chambers, mechanical testers, analytical metrology equipment).
Document and publish technical reports summarizing test results and recommendations.
Develops (structure/process/material/DRM), evaluates, and qualifies next-generation IC package technologies.
Collaborate with internal teams (Design, NPI, Quality) and external suppliers and customers to ensure alignment on reliability and process standards.
Level of Responsibility:
Works under supervision. Decision-making may affect work beyond immediate work group. Requires verbal and written communication skills to convey information. May require basic negotiation, influence, tact, etc.
Has a moderate amount of influence over key organizational decisions.
Minimum Qualifications:
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$127,200.00 - $190,800.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.