The responsibility of this position is to perform full analysis of products to determine root cause of a failure. This effort will consist of using a variety of appropriate mechanical, chemical, and electrical analysis techniques to investigate the product issue. Working with teams inside and outside the department, as well as offshore teams to resolve a given product issue.
Failure Analysis experience in high tech semiconductor devices. Strong knowledge of semiconductor circuit layout and ability to read and use GDSII layout. Thorough knowledge of digital and analog circuit design and operation. Proficiency in various physical and electrical analysis techniques such as IC package decapsulation, curve trace analysis, X-ray inspection, photon and thermal emission analysis Mechanical probe and bench level analysis. Experience in mechanical polishing and chemical delayering of semiconductor devices.
Thorough knowledge of semiconductor wafer fabrication process and IC package assembly process is a plus. as well as experience in operation of bench test equipment.
Required: Bachelor's or equivalent experience