b. Hands on processing experience in semiconductor-like processing steps. c. Must have good dexterity and be able to handle small sensitive parts. d. Must be capable of learning to operate new tools and learning new chemical processing steps. e. Must be observant and based on technical knowledge, identify sources of variability and/or yield impact. f. Must be very flexible to learn new tasks as the workload is varied -- a. Process wafers and/or other substrates through plating, lithography (
