Principal HBM Physical Design Architect

    • Micron Technology, Inc.
  • Folsom, CA
  • Posted 27 days ago | Updated 9 hours ago

Overview

On Site
USD 123,000.00 - 298,000.00 per year
Full Time

Skills

High performance computing
2.5D
Physical data model
Virtual team
Design engineering
Product engineering
Process engineering
Packaging engineering
Interface design
Circuit design
3D computer graphics
Feasibility study
Network design
Timing closure
Problem solving
Storage
Transformation
Innovation
Semiconductors
Design
DRAM
Roadmaps
IP
Optimization
Debugging
ROOT
FOCUS
CMOS
Modeling
Static timing analysis
Planning
Foundry
JEDEC
Specification
Physics
Communication
Leadership
Estimating
Training
Recruiting
Health care
Budget

Job Details

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our Opportunity Summary:

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

As an HBM Physical Design Architect, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute the implementation goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target outstanding performance, power, cost, reliability and quality for Micron's HBM product portfolio.

(Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.

*This position will be a hybrid role located in either Folsom, CA, Allen, TX, or Atlanta, GA.

*The seniority level offered will be based on a combination of experience and education.

What's Encouraged Daily:

  • Defining effective design partitioning and circuit architecture to convert fully custom and asynchronous designs to fully synthesizable and synchronous designs.
  • Working with external customers and IP vendors as well as internal design teams to integrate IP blocks into a fully functioning design.
  • Evaluating and driving optimization of power, performance, and area of key design blocks across various process nodes.
  • Pathfinding to explore new architectures for future HBM products and make recommendations after performing a highly technical feasibility analysis.
  • Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.
  • Engage with Customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.
  • Focus areas within the team will include memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies, and thermal modeling.


How To Qualify:

  • Experience and expertise across the various areas of physical design, including timing closure and STA, clock tree synthesis, floor planning, and power/performance/area optimization.
  • Experience with industry-standard physical design tools and working in a foundry design environment.
  • Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.


What Sets You Apart:

  • In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
  • Good verbal and written communication skills with the ability to effectively synthesize and convey complex technical concepts to other partners and leadership
  • Strong track record of innovation and problem-solving in high-performance memory development
  • Bonus - Good understanding of Memory subsystem operation in high-performance computing applications
  • Prior experience with DRAM product bring-up and debug
  • Prior experience with package technologies (TSV, hybrid bonding, interposers, etc)
  • BSEE or greater
  • 10+ years of relevant Engineering or Design Engineering experience


The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$123,000.00 - $298,000.00

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at or 1- (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.