Overview
On Site
USD 210,000.00 - 290,000.00 per year
Full Time
Skills
Artificial Intelligence
Collaboration
Functional Design
Manufacturing
Integrated Circuit
Semiconductors
2.5D
3D Computer Graphics
Thermal Management
Testing
Security Clearance
Electrical Engineering
Materials Science
Mechanical Engineering
Law
Job Details
Piper Companies is looking for a CoWoS Principle Packaging Engineer who will construct and enhance Chip-on-Wafer-on-Substrate packaging technology to support high-performance AI and data center applications onsite in Saratoga, CA . The ideal CoWoS Principle Packaging Engineer will collaborate with cross-functional teams to facilitate smooth integration of advanced multi-die packages.
Responsibilities for the CoWoS Principle Packaging Engineer:
Qualifications for the CoWoS Principle Packaging Engineer:
Compensation/Benefits for CoWoS Principle Packaging Engineer:
This job opens for applications on 4/30/2025. Applications for this job will be accepted for at least 30 days from the posting date.
Responsibilities for the CoWoS Principle Packaging Engineer:
- Lead the advancement of CoWoS packaging technology to enhance chip performance, power, and reliability.
- Develop and enhance CoWoS packaging processes to ensure superior thermal, mechanical, and electrical performance.
- Work closely with cross-functional design, test, and manufacturing teams for seamless chip-package integration.
- Implement strategies to enhance yield and address failure modes across packaging flows.
Qualifications for the CoWoS Principle Packaging Engineer:
- 15+ years' experience in advanced semiconductor packaging and interconnect processes.
- Demonstrated expertise in CoWoS / FOCoS, or FOWLP and proficient in EMIB, InFO, and advanced 2.5D/3D integration technologies.
- Deep knowledge of thermal management, reliability testing, and signal/power integrity challenges.
- Proven experience working with TSMC and leading OSATs.
- Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
Compensation/Benefits for CoWoS Principle Packaging Engineer:
- Salary/rate range: $210,000 - $290,000 annually
- Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave if required by law, and Holidays.
This job opens for applications on 4/30/2025. Applications for this job will be accepted for at least 30 days from the posting date.
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