Technical Program Manager III

Role: Technical Program Manager III

Location: Sunnyvale, CA(Onsite)

Duration: 12 Months

Top 3 must-have HARD skills:

Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.

Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization.

Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness.

AR/VR experience

Good to have skills:

Experience with AR wearable device development.

Familiarity with small electrical component integration in compact form factors.

Knowledge of advanced PCB fabrication techniques and materials.

Summary
This role supports a business group focused on developing next-generation AR wearable devices. The team is driving innovation in flexible and rigid circuit board design, enabling advanced features in compact form factors. The need arises from increased project volume and the complexity of integrating new electrical components into wearable products.
Responsibilities
Responsible for electrical parts and components in big tech, with a focus on AR wearables and small electrical components.
Work outside standard hours to accommodate collaboration with APAC vendors.
End-to-end ownership of PCB fabrication, including schematics, layouts, and form development through to execution and vendor approval for part fabrication.
Experience in wearables, especially AR wearables and small electrical components.
Key Projects/Day-to-Day Responsibilities
Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards.
Gather feedback, track schedules, and highlight risks throughout the development process.
Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end-to-end, optimizing for schedule, quality, and yield.
Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.
Must-Have Skills
Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization.
Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness.

Nice-to-Have Skills
Experience with AR wearable device development.
Familiarity with small electrical component integration in compact form factors.
Knowledge of advanced PCB fabrication techniques and materials.
Years of Experience
Minimum 5 years in electrical design, PCB development, or related hardware engineering roles.
Experience in wearables or consumer electronics preferred.
Degrees/Certifications Required
Degree in Electrical Engineering or related field preferred but not required.
Relevant experience is more important than formal education.