Package Designer -- Signal Integrity (SI) and Power Integrity (PI)

Overview

On Site
Depends on Experience
Accepts corp to corp applications
Contract - Independent
Contract - W2
Contract - 12 Month(s)

Skills

Electrical Engineering
2.5D
3D Computer Graphics
Allegro
Assembly
Cadence
DDR SDRAM
Electronics
Embedded Systems
Feasibility Study
IC
Integrated Circuit
Internal Communications
Layout
Manufacturing
Mechanical Engineering
Mixed-signal Integrated Circuit
Packaging Design
Routing
SERDES
RF
UPS

Job Details

Signal Integrity (SI) and Power Integrity (PI) Engineer || Sanjose || USA

Total Experience: 5+ Years

Location: SanJose

Work from office / Onsite

Package designer

We are looking for an experienced packaging designer to develop creative and cost-effective packaging designs.

JOB DESCRIPTION

Netlist creation, BGA creation as per the inputs

Conduct feasibility studies to advise optimum pad layout, interconnect types and substrate parameters for a specific IC device or application.

Define substrate stack-ups, routing strategies and via structures.

Substrate design experience for RF, digital, high-speed and mixed signal die

Excellent understanding of SI/PI requirement for routing HSIO (DDR, SERDES, etc).

Good experience in UCIE-Advanced and Standard technology, HBM technology.

Experience in setting design rule checks (DRC) to ensure layouts meet specific manufacturing, Assembly and design guidelines.

Experience of optimise the die breakout for signals and create patterns for High power.

Strong understanding of HDI substrate technologies, layout design rules, and materials for optimal performance. Verify designs against electrical, thermal, mechanical, and manufacturability requirements.

Knowledge on different Package types.

Experience in Wire bond, Flip chip Substrate designs.

Hands on experience with Wire bond, Flip chip & advanced packaging technologies (2.5D, 3D, RDL, embedded passives, etc.)

Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWoS.

Knowledge of different OSAT design rules

QUALIFICATION :

Bachelor s degree in Electronics /Electrical Engineering,

5 to 8+ years in IC package design and development.

Proficiency with Cadence Allegro Package Designer.

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