DMTS - Package Materials Integration Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join our dynamic and forward-thinking team that is molding the future of technology!

Position Overview:

As a Package Materials Integrator in Advanced Packaging Technology Development (APTD), you will lead and drive the materials roadmap for Mircon's advanced 3D memory products including HBM and 3DS DRAM. You will collaborate with Micron's multi-functional team that includes process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving materials suppliers to meet roadmap needs, leading materials aspects of program execution, and resolving all materials-package interaction issues.

Responsibilities will include, but are not limited to:

• Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines.
• Own a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.).
• Drive suppliers at the executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements and timelines.
• Partner with process engineering, equipment development, and process integration to ensure all TD deliverables are met.
• Drive materials characterization to understand materials-package interaction mechanisms using analytical, mechanical and thermal testing and analysis.
• Develop novel materials solutions in conjunction with advanced packaging and product teams to recommend the optimum package solutions to meet electrical, mechanical, thermal, reliability, cost, and other system level requirements.
• Experience and solid understanding of 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
• Experience and solid understanding with materials used throughout the advanced packaging flow.

Required Experience:

• Master of Science/PhD in chemistry, chemical engineering, materials science or related engineering field or equivalent experience.
• 15+ years of confirmed experience in semiconductor manufacturing.
• Strong understanding of semiconductor process integration and process development.
• Validated project management skills and experience driving multi-functional technical teams
• Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners.

Preferred Experience:

• Experience with advanced memory packaging preferred.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

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