Overview
On Site
$140,000 - $145,000
Full Time
Accepts corp to corp applications
Skills
semiconductor packaging design
advanced packaging technologies
VLSI domain
SIPI
Flip-chip package design concepts
Job Details
Role: Silicon Design Package Designer Location: Santa Clara, CA
Work Mode: Onsite
This role is highly specialized in semiconductor packaging design, requiring strong EDA tool proficiency and knowledge of advanced packaging technologies.
Key Responsibilities & Skills:
- Tools & Knowledge:
- Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA).
- Technical Expertise:
- Multi-layer package design experience.
- Understanding of substrate manufacturing Design Rules and Assembly Rules.
- Familiarity with SIPI (Signal Integrity & Power Integrity) Rules.
- Flip-chip package design concepts.
- Tasks:
- Perform point-to-point connections.
- Run DRC (Design Rule Checks), identify root causes, and fix issues.
- Execute design based on provided schematics, including component placement and constraint setup.
*The pay range for this role is $140k- $145k per annum including any bonuses or variable pay. Tech Mahindra also offers benefits like medical, vision, dental, life, disability insurance and paid time off (including holidays, parental leave, and sick leave, as required by law). Ask our recruiters for more details on our Benefits package. The exact offer terms will depend on the skill level, educational qualifications, experience, and location of the candidate.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.