Senior Signal and Power Integrity Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering Microsoft's "Intelligent Cloud" mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.

The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state of the art custom computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more.

We are seeking a Senior Signal Integrity and Power Integrity (SIPI) Engineer to join the engineering team responsible for developing advanced power delivery and signaling solutions for High Performance Computing (HPC) silicon designs. In this role, you will be responsible for driving the completion of SIPI design solutions supporting overall SOC performance interfacing with silicon, packaging, and system design teams.

Responsibilities:

• The SMPE silicon team is seeking a passionate, driven, and intellectually curious computer/electrical engineer to deliver premium-quality designs once considered impossible. We are responsible for delivering cutting-edge, custom IP and SoC designs that can perform complex and high-performance functions in an extremely efficient manner.
• SIPI engineer for compute and AI SoCs and platforms - Implement strategies for end-to-end power delivery design and signal integrity design from Silicon to Package, and linking to Platform to System and Cloud
• Deliver SIPI solutions that meet the HPC demands across the entire system.
• Drive future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes
• Design, model, and simulate SI and PI (i.e., incl. IP design, voltage regulator, motherboard, CPU package, silicon, and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance. Performs DC, AC and transient simulation to provide noise, impedance profile of the whole power delivery path and link/electrical simulations to validate I/O performance from platform to silicon.
• Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
• Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines
• Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Qualifications:

Required Qualifications:

• Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience
  • OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience
  • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience
  • OR equivalent experience.
• 1 year of experience in design and electrical modelling of Signal and Power Integrity, System design, IP design with knowledge on product development

Other Requirements:

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to, the following specialized security screenings:

• Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter

Preferred Qualifications:

• MSEE degree with 10 years' experience in silicon packaging products development
• Experience with high-speed signal design and/or power integrity modelling for HPC products
• Strong foundation in advanced packaging technologies as it relates to Signal and Power integrity
• Experience with Foundry Silicon technologies, OSAT technologies and Substrate technologies
• Good working knowledge in the field of end to end system SIPI Design and Architecture
• Industry knowledge, trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology and Platform design
• Excellent interpersonal skills including written and verbal communication, teamwork, negotiation, and presentation

Silicon Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $158,400 - $258,000 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: ;br>
Microsoft will accept applications for the role until October 6, 2025.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form .

Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.

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