Principal Digital Electronics Design Engineer

Security clearance: Current in scope Top Secret government security clearance is required for this position.

Role:

In this position you will work closely with multi-disciplinary teams designing, developing, and verifying high reliability digital electronics for use in a wide array of applications.

These applications include processor boards, FPGA and SOC boards, memory applications including DDR and high speed I/O.

As a principal member of the Harsh Environments Electronics Group you will help shape digital hardware architectures and lead electronics development activities by applying sound engineering and project management principles.

Candidate must be self-motivated and capable of working at a high technical level with minimal supervision.

Duties/Responsibilities

Translate project and system requirements into well-defined hardware architectures working with cross-functional teams.
Design and/or complete instruments including microprocessors, power, and analog components.
Innovatively solve issues, drive completion of the project to schedule, and collaboratively work with other technical contributors.
Build and test prototypes, debug, and prepare documentation for manufacturing, and support.
Research and enable innovative solutions for cutting-edge designs.
Engage other engineers and partners to develop reliable, cost effective and solutions for products.
Independently drive solutions to complex problems develop requirements, propose ways forward when customer requirements are unclear or incomplete, and adapt appropriately to changes in requirements.
Subject Matter Expert (SME) able to perform advanced architectures and designs for complex ASICs.
Involved in business development and proposal activities.
Identify program/system-level technical risks and develop and execute mitigation strategies.
Manage multi-disciplinary tasks with multiple engineers and effectively communicate status to project leadership and customers.
Develop, document, and teach best practices to less experienced engineers.
Performs other duties as assigned.

Required Qualifications:

Experience working with and knowledge of trade space for radiation hardened parts

Schematic capture and board layout experience

Experience integrating and debugging embedded systems

Ability to perform circuit simulation using tools such as HyperLynx or Ansys

Preferred Qualifications:

Experience in Mentor Graphics PCB design flow

Experience with Xilinx or Microchip FPGA/SOC design flow

Experience in design for harsh environments as embodied in common commercial and military standards (e.g. RTCA/DO-160, MIL-STD-810, etc.)

Skills/Abilities

Proficiency in electronic design, microprocessor or embedded computing.
Understanding of design and general computer architecture.
Ability to write detailed design specifications.
Computer programming and coding abilities.
Excellent verbal and written communication skills.
Excellent mathematical skills.
Excellent organizational skills and attention to detail.
Excellent time management skills with the proven ability to meet deadlines.
Strong analytical and problem-solving skills.
Ability to prioritize tasks.
Thorough understanding of engineering theories and procedures.
Strong organization, planning, and time management skills to achieve program goals.

Education

Bachelor s degree in Electronic or Electrical Engineering or related field. Master s Degree preferred.

Experience

7-10 years experience in Electronic or Electrical Engineering or related.

Additional Job Description:

Current in scope Top Secret government security clearance is required for this position.

This is a hybrid position between remote and in-lab work.

The ability to be onsite as needed will be required.