Overview
On Site
$135,000 - $155,000 annually
Full Time
Skills
Root cause analysis
Profit and loss
Design of experiments
Statistical process control
Process engineering
Corrective and preventive action
Product development
Project management
Product management
Microsoft Office
Business management
Data Analysis
Test methods
Packaging design
Management
Offshoring
MASS
IC
Assembly
Scheduling
Design
Data
Communication
Presentations
Leadership
Manufacturing
Integrated circuit
Job Details
RESPONSIBILITIES:
Kforce's client, a growing small to medium size nationwide Semiconductor company is seeking a Senior Technical Project Manager-IC Packaging for FCBGA products in Chandler, AZ. The primary function of this position is to manage the Business Units key customer accounts. We are working directly with the hiring manager on this search assignment. This position is hybrid remote.
Responsibilities:
* Management of internal process development and co-development programs in support of customers, offshore factories and supplier development teams and support the qualification and mass production of FCBGA products
* Senior Technical Project Manager-IC Packaging (FCBGA products) will help define and concurrently manage multiple programs through internal management systems, as well as identify and develop new customers
* Work with customers to understand the assembly, reliability, and scheduling requirements for various package qualifications, which may include substrate design, die stacking requirements, material selection, and supplier selection
* As a Senior Technical Project Manager-IC Packaging (FCBGA products), you will work with customers to understand and characterize package-silicon interactions that may be identified during prototype builds, qualifications, or production ramp; This will include designing experiments, analyzing data, and supporting the root cause analysis and corrective action process
* Work with Company's advanced product development teams on the transfer of new packaging technologies to production; This will include supporting the final qualification and initial production ramp
REQUIREMENTS:
* This position requires a Bachelor's degree in Engineering (Materials Science, Mechanical Engineering, Microelectronics or similar)
* A minimum of 5-7+ years of demonstrated industry experience, with FCBGA product development experience desired
* Project management experience with knowledge of surface mount technologies and final package form factors
* Direct prior product management experience involving offshore factory assets and the ability to multiplex across numerous programs and teams is essential
* Excellent written and verbal communication skills
* Proficiency with Microsoft Office is required
Nice to haves:
* Technical presentations to customers
* Demonstrated leadership and business management experience with P&L responsibility is highly desired
* Demonstrated ability to work independently in a heavily matrixed organization and have experience with design and manufacturing systems used in modules or other highly integrated packages is desired
* Knowledge of material and package characterization data analysis, test methods and qualification procedures desired
* Familiarity with Design of Experiments and Statistical Process Control is a plus
* Flip Chip package design and OSAT experience will be a plus
The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
Kforce's client, a growing small to medium size nationwide Semiconductor company is seeking a Senior Technical Project Manager-IC Packaging for FCBGA products in Chandler, AZ. The primary function of this position is to manage the Business Units key customer accounts. We are working directly with the hiring manager on this search assignment. This position is hybrid remote.
Responsibilities:
* Management of internal process development and co-development programs in support of customers, offshore factories and supplier development teams and support the qualification and mass production of FCBGA products
* Senior Technical Project Manager-IC Packaging (FCBGA products) will help define and concurrently manage multiple programs through internal management systems, as well as identify and develop new customers
* Work with customers to understand the assembly, reliability, and scheduling requirements for various package qualifications, which may include substrate design, die stacking requirements, material selection, and supplier selection
* As a Senior Technical Project Manager-IC Packaging (FCBGA products), you will work with customers to understand and characterize package-silicon interactions that may be identified during prototype builds, qualifications, or production ramp; This will include designing experiments, analyzing data, and supporting the root cause analysis and corrective action process
* Work with Company's advanced product development teams on the transfer of new packaging technologies to production; This will include supporting the final qualification and initial production ramp
REQUIREMENTS:
* This position requires a Bachelor's degree in Engineering (Materials Science, Mechanical Engineering, Microelectronics or similar)
* A minimum of 5-7+ years of demonstrated industry experience, with FCBGA product development experience desired
* Project management experience with knowledge of surface mount technologies and final package form factors
* Direct prior product management experience involving offshore factory assets and the ability to multiplex across numerous programs and teams is essential
* Excellent written and verbal communication skills
* Proficiency with Microsoft Office is required
Nice to haves:
* Technical presentations to customers
* Demonstrated leadership and business management experience with P&L responsibility is highly desired
* Demonstrated ability to work independently in a heavily matrixed organization and have experience with design and manufacturing systems used in modules or other highly integrated packages is desired
* Knowledge of material and package characterization data analysis, test methods and qualification procedures desired
* Familiarity with Design of Experiments and Statistical Process Control is a plus
* Flip Chip package design and OSAT experience will be a plus
The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.