Overview
On Site
USD 158,000.00 - 237,000.00 per year
Full Time
Skills
Policies and procedures
Consumer goods
Circuit design
RF engineering
Product QA
Computer engineering
ESD
Design
Art
CMOS
IoT
IP
Debugging
Science
ASIC
Interfaces
PCI Express
USB
DDR SDRAM
RF
DAC
System on a chip
Publishing
Layout
Foundry
Data
Clinical data management
Testing
RMA
IO
JEDEC
Specification
Physics
Cadence
Schematic
HSPICE
SPICE
Simulation
Integrated circuit
International relations
Extraction
Communication
Teamwork
Electrical engineering
Recruiting
Law
Sales
Job Details
Company:Qualcomm Technologies, Inc.
Job Area:Engineering Group, Engineering Group > ASICS Engineering
General Summary:
This is a position in the ESD team working on ESD designs in state of art CMOS/FinFET technology nodes for Qualcomm's advanced mobile baseband, Auto, IOE/IOT & consumer products. Join QCT's IP team in designing and implementing efficient ESD protection schemes for Qualcomm's next generation chipsets. The team is involved in the complete product lifecycle including ESD design from the development and library stage to tapeout as well as post-silicon support and debug of qualification failures and field returns.
Minimum Qualifications:
Bachelor's degree in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 5+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
Responsibilities:
- ESD Circuit design for General Purpose I/O (GPIO), Custom I/O, Speciality I/O and high-speed interfaces (PCIE, USB, DDR etc.)
- ESD design for Digital, Analog & RF blocks such as DAC, PLL, LNA etc.
- ESD design at the IP & SOC levels including die and package
- Developing ESD libraries and publishing ESD guidelines for circuit, layout and package designers based on test chips and foundry data
- TLP/VFTLP/CDM testing for design and debug
- Silicon validation and debugging ESD failures along with RMA analysis
- ESD co-design by working closely with IO, Analog, RF design/layout engineers & Packaging team
- Working with Product testing and Reliability teams for qualification and meeting JEDEC specifications for ESD and Latch-up
Skills/Experience
- Experience with ESD Circuit Design and Latchup along with debugging and FA
- Hands on experience with TLP/VFTLP
- Transistor level circuit design/analysis knowledge (Analog & Digital) and device physics
- Experience with Cadence circuit design tools (Schematic, Analog Artist, and Layout), PERC, ERC and Redhawk Pathfinder
- Experience using Hspice (or any other Industry standard) Spice simulator.
- Knowledge of full custom layout and experience working closely with mask designers is required
- Familiarity with different IC package types (FlipChip, Wirebond, WLP) and associated ESD protection
- Experience with System/board level ESD protection and IEC standards is a plus
- Experience with FINFET technology is a plus
- Familiarity with views for ASIC design flow such as LEF along with analysis of IR drop and LPE extraction is a plus.
- Good communication and teamwork skills
- Ability to efficiently work on multiple projects simultaneously.
Educational Requirements
Required: Bachelor's in Electrical or Computer Engineering
Preferred: Master's or Ph.D in Electrical or Computer Engineering
Although this role has some expected minor physical activity, this should not deter otherwise qualified applicants from applying. If you are an individual with a physical or mental disability and need an accommodation during the application/hiring process, please call Qualcomm's toll-free number found for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities as part of our ongoing efforts to create an accessible workplace.
Qualcomm is an equal opportunity employer and supports workforce diversity.
To all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range:
$158,000.00 - $237,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer!
If you would like more information about this role, please contact .
Job Area:Engineering Group, Engineering Group > ASICS Engineering
General Summary:
This is a position in the ESD team working on ESD designs in state of art CMOS/FinFET technology nodes for Qualcomm's advanced mobile baseband, Auto, IOE/IOT & consumer products. Join QCT's IP team in designing and implementing efficient ESD protection schemes for Qualcomm's next generation chipsets. The team is involved in the complete product lifecycle including ESD design from the development and library stage to tapeout as well as post-silicon support and debug of qualification failures and field returns.
Minimum Qualifications:
Bachelor's degree in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 5+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
Responsibilities:
- ESD Circuit design for General Purpose I/O (GPIO), Custom I/O, Speciality I/O and high-speed interfaces (PCIE, USB, DDR etc.)
- ESD design for Digital, Analog & RF blocks such as DAC, PLL, LNA etc.
- ESD design at the IP & SOC levels including die and package
- Developing ESD libraries and publishing ESD guidelines for circuit, layout and package designers based on test chips and foundry data
- TLP/VFTLP/CDM testing for design and debug
- Silicon validation and debugging ESD failures along with RMA analysis
- ESD co-design by working closely with IO, Analog, RF design/layout engineers & Packaging team
- Working with Product testing and Reliability teams for qualification and meeting JEDEC specifications for ESD and Latch-up
Skills/Experience
- Experience with ESD Circuit Design and Latchup along with debugging and FA
- Hands on experience with TLP/VFTLP
- Transistor level circuit design/analysis knowledge (Analog & Digital) and device physics
- Experience with Cadence circuit design tools (Schematic, Analog Artist, and Layout), PERC, ERC and Redhawk Pathfinder
- Experience using Hspice (or any other Industry standard) Spice simulator.
- Knowledge of full custom layout and experience working closely with mask designers is required
- Familiarity with different IC package types (FlipChip, Wirebond, WLP) and associated ESD protection
- Experience with System/board level ESD protection and IEC standards is a plus
- Experience with FINFET technology is a plus
- Familiarity with views for ASIC design flow such as LEF along with analysis of IR drop and LPE extraction is a plus.
- Good communication and teamwork skills
- Ability to efficiently work on multiple projects simultaneously.
Educational Requirements
Required: Bachelor's in Electrical or Computer Engineering
Preferred: Master's or Ph.D in Electrical or Computer Engineering
Although this role has some expected minor physical activity, this should not deter otherwise qualified applicants from applying. If you are an individual with a physical or mental disability and need an accommodation during the application/hiring process, please call Qualcomm's toll-free number found for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities as part of our ongoing efforts to create an accessible workplace.
Qualcomm is an equal opportunity employer and supports workforce diversity.
To all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range:
$158,000.00 - $237,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer!
If you would like more information about this role, please contact .