Signal Integrity Engineer

About Us

Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up and spec to product. With 3200+ employees worldwide, Tessolve delivers a one-stop solution with advanced silicon and system testing labs.

We offer Turnkey ASIC Solutions from design to packaged parts, leveraging strong ecosystem partnerships with EDA, IP, and foundry vendors. Our integrated front-end and backend expertise reduces design risks and accelerates time-to-market.

Our R&D centers of excellence focus on emerging technologies such as 5G, mmWave, Silicon Photonics, HSIO, HBM/HPI, and System-Level Test. Tessolve also delivers end-to-end embedded product design services under an ODM model for Avionics, Automotive, Industrial, and Medical applications.

Tessolve s clientele includes 9 of the top 10 semiconductor companies, along with Tier-1 clients, start-ups, and government entities. We have a global presence in 12+ countries, with advanced test labs in India, Singapore, Malaysia, Austin, and San Jose.

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Role: Signal Integrity (SI) Engineer

We are seeking an experienced Signal Integrity Engineer with a strong background in high-speed interface design and validation. The engineer will work on state-of-the-art technologies such as LPDDR5X, PCIe Gen7, and UCIe (64G), collaborating closely with design, package, and PCB teams to ensure optimal signal performance.

Key Responsibilities:

• Perform channel modeling, extraction, and eye diagram analysis for high-speed interfaces.
• Conduct pre- and post-layout simulations to ensure compliance with interface and electrical standards.
• Analyze crosstalk, reflections, jitter, insertion loss, and return loss to identify and resolve signal issues.
• Partner with design, packaging, and PCB layout teams to optimize overall signal integrity (SI) performance.
• Generate comprehensive reports and design recommendations based on simulation and analysis results.

Required Qualifications:

• Bachelor s or Master s degree in Electrical/Electronics Engineering or a related discipline.
• Strong background in signal integrity for high-speed serial and memory interfaces.
• Hands-on experience with simulation tools such as:
• HFSS / Clarity, Siwave / PowerSI, SystemSI / ADS / AEDT.
• Familiarity with JEDEC (LPDDR5/6), PCIe, and UCIe standards.
• Excellent analytical, problem-solving, and cross-functional collaboration skills.

Why Tessolve

Join a global semiconductor solutions leader, where you ll work on cutting-edge packaging design projects across advanced technologies, collaborate with world-class engineering teams, and help shape the future of semiconductor innovation.

Equal Opportunity Employer

Tessolve is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, veteran status, or any other protected characteristic.