Overview
On Site
$190,000 - $250,000 annually
Full Time
Skills
Research and development
Design of experiments
Statistical process control
Product management
Tier 1
Program management
Power electronics
Project development
Process engineering
Packaging design
Leadership
Product marketing
Semiconductors
IC
Recruiting
Microcontrollers
UPS
Collaboration
Exceed
Management
Design
IO
Electrical engineering
Communication
Presentations
Roadmaps
Translation
Offshoring
Mechanical engineering
Modeling
Job Details
RESPONSIBILITIES:
Kforce's client, a growing and established Semiconductor company is seeking a Senior Director of Product Management - IC Packaging in Chandler, AZ. We have been recruiting for this company for over 25+ years and work directly with the Hiring Managers. This position is hybrid remote. The candidate will be a primary interface with Tier 1 customers and the company's leading-edge R&D center in Asia.
Responsibilities:
* Senior Director of Product Management - IC Packaging will drive and coordinate development activities with customers and Company's development teams
* Will provide program management for development of packaging for the Wire bond and Power business unit focusing on analog, microcontroller, and the power electronics market segments
* Lead Tier 1 customer meetings, discussions, and follow-ups during project development for wire-bonded packages, lead frame packages and power packages
* As a Senior Director of Product Management - IC Packaging, you will coordinate and collaborate with all company resources as are required to execute R&D projects that will exceed all customer requirements
* Manage and lead cross-functional teams comprised of design center and characterization resources to optimize novel designs and to establish design rules for new IC package families
* Manage product management through initial production ramp
REQUIREMENTS:
* Bachelor's degree in Engineering (Mechanical, Chemical, or Materials Science)
* At least 12-15+ years of experience in semiconductor packaging development is required
* Able to work independently in a global organization with demonstrated experience in IC package process development
* Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures are required
* Working knowledge of IC IO drivers and associated electrical interactions and trade-offs with different IC packaging technologies
* Understand the IC package design environment, and tradeoffs associated with package design during package process development
* Demonstrated, effective leadership skills and capabilities
* Excellent written and verbal communication, presentation skills required
* Customer product roadmap translation to IC packaging development roadmap
* Requires approximately 35 to 40% travel (Domestic & International)
* Direct previous product management experience involving offshore process development is highly desired
* Knowledge of thermal or mechanical simulations and modeling is preferred
* Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus
The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
Kforce's client, a growing and established Semiconductor company is seeking a Senior Director of Product Management - IC Packaging in Chandler, AZ. We have been recruiting for this company for over 25+ years and work directly with the Hiring Managers. This position is hybrid remote. The candidate will be a primary interface with Tier 1 customers and the company's leading-edge R&D center in Asia.
Responsibilities:
* Senior Director of Product Management - IC Packaging will drive and coordinate development activities with customers and Company's development teams
* Will provide program management for development of packaging for the Wire bond and Power business unit focusing on analog, microcontroller, and the power electronics market segments
* Lead Tier 1 customer meetings, discussions, and follow-ups during project development for wire-bonded packages, lead frame packages and power packages
* As a Senior Director of Product Management - IC Packaging, you will coordinate and collaborate with all company resources as are required to execute R&D projects that will exceed all customer requirements
* Manage and lead cross-functional teams comprised of design center and characterization resources to optimize novel designs and to establish design rules for new IC package families
* Manage product management through initial production ramp
REQUIREMENTS:
* Bachelor's degree in Engineering (Mechanical, Chemical, or Materials Science)
* At least 12-15+ years of experience in semiconductor packaging development is required
* Able to work independently in a global organization with demonstrated experience in IC package process development
* Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures are required
* Working knowledge of IC IO drivers and associated electrical interactions and trade-offs with different IC packaging technologies
* Understand the IC package design environment, and tradeoffs associated with package design during package process development
* Demonstrated, effective leadership skills and capabilities
* Excellent written and verbal communication, presentation skills required
* Customer product roadmap translation to IC packaging development roadmap
* Requires approximately 35 to 40% travel (Domestic & International)
* Direct previous product management experience involving offshore process development is highly desired
* Knowledge of thermal or mechanical simulations and modeling is preferred
* Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus
The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.