Package Design Engineer

Overview

On Site
$50 - $60
Contract - W2
Contract - Independent
Contract - 1 Year(s)

Skills

Cadence
Cadence Tools
Packaging Design
PCB
Design Engineer
PLA tools
Mentor Graphics
DFM
Design for Manufacturing
Bump layout
Package reliability aspects
Package validation

Job Details

Requirements/Skills:
Exp: 5-8 years of experience.

  1. Possess Mentor Graphics, Cadence, PLA knowledge
  2. Multiple layers package design (8+) experience
  3. Understanding of substrate manufacturing design rule and assembly rule
  4. Possess Flip Chip Package Design Concept
  5. Good communication skill.
  6. May require vendor on-site support

Regards

Rohit

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