Overview
On Site
Depends on Experience
Accepts corp to corp applications
Contract - Independent
Contract - W2
Contract - 12 Month(s)
Skills
Assembly
Cadence
Communication
Integrated Circuit
Manufacturing
Mentor Graphics
Packaging Design
Job Details
Package Design Engineer in the US, please share the relevant profiles ASAP.
Exp: 5-8 years of experience.
Location: US (San Jose) Candidate should be Onsite (Mandatory)
Requirements/Skills:
Possess Mentor Graphics, Cadence, PLA knowledge
Multiple layers package design (8+) experience
Understanding of substrate manufacturing design rule and assembly rule
Possess Flip Chip Package Design Concept
Good communication skill.
May require vendor on-site support
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