AI Data Center High-Speed Interconnect Architect

We are seeking a highly experienced AI Data Center Power Architect to lead the design and definition of power delivery architectures for next-generation AI servers and racks, including power connectors, whips, and liquid-cooled busbar systems.

This role will focus on achieving scalability, reliability, and efficiency while ensuring compliance with relevant industry standards and electrical safety regulations. The Power Architect will collaborate with cross-functional engineering and product teams to define roadmaps and support customer adoption of advanced AI infrastructure solutions.

• Design & Optimization:
  Architect and optimize power distribution systems (connectors, cables, busbars, whips) for AI servers with high-current (130 3,000A) applications, ensuring precise alignment ( 1.00mm) and thermal efficiency in dense GPU/TPU environments.

• Power Estimation & Modeling:
  Build and maintain power estimation models and analysis tools for AI server and rack-level systems. Conduct performance versus power trade-offs to improve Perf/Watt and reduce TCO for large-scale AI platforms.

• Compliance & Standards:
  Ensure all designs comply with IEC 61439, IEEE, and applicable safety and thermal standards. Support reliability and environmental testing (-40 C to +125 C).

• Cross-Functional Collaboration:
  Partner with internal teams across Sales, PLM, and R&D to align power architecture with next-generation AI infrastructure requirements.

• Innovation & Technology Trends:
  Integrate advanced technologies such as liquid-cooled busbars, low-GWP cooling systems, and high-conductivity copper alloys to increase power density and thermal performance.

• Industry Engagement:
  Participate in technical forums and industry groups (e.g., OCP, OIF, IEEE) to stay ahead of emerging standards and promote architectural leadership.

• Education:

  • Bachelor s degree in Electrical Engineering, Mechanical Engineering, Power Systems, or a related field.

  • Master s or Ph.D. preferred in Power Mechanics, Thermal Engineering, or Applied Physics.

• Experience:

  • 10 15 years of experience in power architecture for high-density systems (100kW 1MW per rack), preferably within AI/ML infrastructure.

  • Proven expertise in connector and busbar design (liquid-cooled, solder-tail, or screw-mount) and high-current systems up to 3,000A.

  • Strong understanding of thermal management and liquid-cooling techniques for AI workloads.

  • Hands-on experience with IEC/IEEE compliance, CAD tools, and system validation (e.g., 25kA short-circuit rating).

  • Experience collaborating with OEMs, chip vendors, and data center operators to optimize power delivery for AI/ML systems.

• Preferred:

  • Familiarity with AI reference architectures (e.g., NVIDIA 132kW/rack).

  • Knowledge of BBU/powershelf workload management systems.

  • Excellent communication skills for cross-functional and customer collaboration.

• Background check required prior to employment.

• Competitive base salary with comprehensive benefits package.

• Equal Opportunity Employer all qualified applicants will be considered without regard to race, color, religion, gender, sexual orientation, national origin, disability, or veteran status.