Overview
On Site
Depends on Experience
Accepts corp to corp applications
Contract - Independent
Contract - W2
Contract - 12 Month(s)
Skills
Packaging Design
IC
CoWoS
Wire bond
Flip chip
Job Details
Position: Package designer
Total Experience: 5+ Years
Work from office / Onsite
We are seeking an experienced packaging designer to develop innovative and cost-effective packaging designs.
JOB DESCRIPTION
- Netlist creation, BGA creation as per the inputs
- Conduct feasibility studies to advise optimum pad layout, interconnect types, and substrate parameters for a specific IC device or application.
- Define substrate stack-ups, routing strategies, and via structures.
- Substrate design experience for RF, digital, high-speed, and mixed signal die
- Excellent understanding of SI/PI requirements for routing HSIO (DDR, SERDES, etc).
- Good experience in UCIE-Advanced and Standard technology, HBM technology.
- Experience in setting design rule checks (DRC) to ensure layouts meet specific manufacturing, Assembly, and design guidelines.
- Experience in optimizing die breakout for signals and creating patterns for High power.
- Strong understanding of HDI substrate technologies, layout design rules, and materials for optimal performance. Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
- Knowledge on different Package types.
- Experience in Wire bond, Flip chip Substrate designs.
- Hands-on experience with Wire bond, Flip chip & advanced packaging technologies (2.5D, 3D, RDL, embedded passives, etc.)
- Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWoS.
- Knowledge of different OSAT design rules
QUALIFICATION :
- Bachelor s degree in Electronics /Electrical Engineering,
- 3 to 8+ years in IC package design and development.
- Proficiency with Cadence Allegro Package Designer.
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