Design Lead with Build Coordination

Overview

On Site
Depends on Experience
Contract - Independent
Contract - W2
Contract - 12 Month(s)

Skills

hardware
software
DOE
DFM
NPI
GSM
Engineering
BOM
design
Mechanical
Electrical

Job Details

Job Description: Technical/Functional Skills:
Demonstrable track record of developing engineered solutions, preferably involving HW and SW, including definition, sourcing, bring-up, debug, production qualification and scaling.
Experience with a variety of products and test processes is desirable.
Solid understanding of system architectures for a variety of electronic products.
Experience in production control processes, data analysis, solid statistical skills
Exposure to electronic manufacturing partner supplier management in some capacity.

Experience Required:
Minimum five years of technical work experience, preferably in a test or a manufacturing environment.
Experience working with equipment suppliers

Roles & Responsibilities:
Lead technical solution triaging in DOE, DFM build feedback.
Solve technical problems both independently and with co-workers.
Coordinate with cross functional team for NPI product build (SW, EE, ME, TE) to define, develop and build NPI products for Engineering.
Present weekly program status updates to internal teams, as required.
Communicate cross-functionally with engineering and business teams, as required. (Typical teams include HW Engineering, HW Test, GSM, Operations PM, etc.)
set and track build goals, working with product development vendors to ensure the parts are produced as per approved designs, Manage cost of parts and fixtures required for various builds
Work with the software and hardware module development leaders to understand the functioning, performance
Engage with CMs for execution of builds as per plan and provide technical support to resolve issues
Manage supplier engineering performance and communicate progress.
Manage multiple simultaneous introductions of a new service module for smartphone / laptop
Manage test engineering aspects of plan-of-record project schedule, including communication of status, risks and changes

Design change tracking:
Boards/flexes design release, tracking fabrication approval, Release to vendor and drive DFM feedback to closures.
Collect design change information at each build and track the accurate revision of parts/materials and their tooling schedule to meet system build on time

Material tracking:
Collect material information and maintain it up to date on DRP during Engineering developments.
Material demand release to vendors.
Drive build to meet input plan in micro-schedule.
Create System BOM and maintain BOM in database during design changes

Build readiness coordination:
Coordinate with cross functional teams on build rules and generate it into system configs in build matrix.
Work with upstream module/component vendors to track build schedule, drive daily communication with Contract Manufacturers on material risks to meet System input schedule.
Coordinate materials and configs required to support DOEs during the builds.
Logistic support on shipments between US and factories overseas and manage the sample inventory
Manage equipment design aspects of project, including
Identifying needed design items in consultation with team members,
Obtaining quotations (with engineering assistance) and initiating purchase requisitions,
Tracking status of design, quotation, purchase, delivery and overall readiness, and
Tracking design, quality and performance issues with equipment
Manage overall engineering readiness checklists, including
Revise existing checklists to include any new, relevant aspects of current project,
Review and update checklist status with team members in a simple, time efficient manner, and
Highlight any at-risk checklist items in a timely manner.

Generic Managerial Skills:
Requires demonstrated leadership skills - a self-starter with people skills.
Detail-oriented and action-oriented.
Experience as a successful technical project leader.
Excellent written and oral / presentation skills.
Comfort working in a dynamic, fast-paced and sometimes ambiguous environment
Demonstrated ability to work independently while making sound technical decisions.
Ability to travel internationally as required.
Demonstrates a can do approach to problem solving. Humble. Graceful under fire.

Education:
BS in Mechanical Engineering and Electrical Engineering. MS preferred.

Key words:
Hardware design Lead, board bring-up, embedded systems, embedded architecture, hardware testing, test equipment validation, system level integration.

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