Principal Applications Engineer

  • Irvine, CA
  • Posted 2 days ago | Updated 2 days ago

Overview

On Site
$120,000 - $150,000
Full Time

Skills

semiconductor
packaging
chemical
materials
molding
2.5D
3D
applications
products
mechanical
engineering

Job Details

Title: Principal Applications Engineer
Industry: Manufacturing & Production
Location: Irvine, CA.
Salary Range: $120,000 $150,000
Employment Type: Full-Time
Relocation Assistance: Possible for ideal candidate
Travel: Up to 10%

About the Opportunity
We are seeking a highly experienced Principal Applications Engineer to support our advanced semiconductor packaging materials. This role provides an exciting opportunity to apply your technical expertise to solve complex material and process challenges, optimize applications, and support customer success.

Position Overview
The Principal Applications Engineer will:

  • Serve as the technical lead for both developmental and commercial products within advanced packaging materials.

  • Troubleshoot and solve product and process-related issues, providing expert guidance to customers.

  • Develop in-depth application knowledge of semiconductor packaging materials, including 2.5D and 3D packaging trends.

  • Ensure new and existing products deliver clear value to customers through optimized application processes.

  • Apply novel approaches to process development, material characterization, and technology-specific problem-solving.

Qualifications

  • Bachelor s degree in Material Science, Mechanical Engineering, Chemical Engineering, or related field; advanced degrees preferred.

  • 10+ years of experience in semiconductor packaging or related chemical/materials applications.

  • Expertise in wafer-level encapsulation, molding processes, and advanced packaging techniques.

  • Strong verbal and written communication skills; comfortable interacting with customers and presenting to groups.

  • Ability to work independently and collaboratively on multiple assignments.

  • Customer-focused mindset with strong ownership and project management skills.

  • Willingness to travel up to 10% for customer support and technical engagements.

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