Overview
On Site
Depends on Experience
Contract - W2
Contract - Independent
Contract - 6 Month(s)
No Travel Required
Unable to Provide Sponsorship
Skills
PLA
DRC
Signal integrity
Power Integrity
package design
Job Details
Key Responsibilities & Skills for Package Designer:
- Tools & Knowledge:
- Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA).
- Technical Expertise:
- Multi-layer package design experience.
- Understanding of substrate manufacturing Design Rules and Assembly Rules.
- Familiarity with SIPI (Signal Integrity & Power Integrity) Rules.
- Flip-chip package design concepts.
- Tasks:
- Perform point-to-point connections.
- Run DRC (Design Rule Checks), identify root causes, and fix issues.
- Execute design based on provided schematics, including component placement and constraint setup.
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