Semiconductor Process Integration Technician

Overview

On Site
Depends on Experience
Contract - W2

Skills

Semiconductors
Process Integration
Research and Development
Wafer
WIP
Inspection
characterization
fabrication

Job Details

Job Title: Semiconductor Process Integration Technician

Duration: 12+ Months (Possibility of Extension)

Location: Albany, NY

Position description:

We are seeking a chip process integration Tech who can work in a highly multi-disciplinary, multi-cultural environment to work on Semiconductor applications at Albany's Research. This candidate will be leading and supporting client's research and development activities in semiconductor technology, focusing on process development and yield improvement. This individual will work as a technician to mature novel processes and integration schemes to build innovative structures that demonstrate the desired performance and yield benefits for client's hardware technologies.

Responsibilities:

  • Track progress of hardware and analyze data to determine best conditions to optimize the process
  • Q-time support for Tools
  • TT Request and coordination
  • Wafer Inspection
  • wafer scrap
  • WIP movement help
  • Spec hold review
  • Chasing wafer breakage
  • Ops/UP related issues
  • Wafer Delivery to FA lab and pickup
  • Various shift coverage
  • Full ownership to identify issues and recommend solutions to improve performance and yield, such as defectivity reduction
  • Condense and present analyses and reports with a focus on effective technical communication
  • Identify and drive opportunities for operational and quality improvements

Required professional and technical expertise:

  • At least 2 years experience in microelectronics FAB as an Integration Tech
  • Hands on experience with Inspection

Preferred Professional and technical expertise:

  • At least 5 years experience in microelectronics materials, process integration and device characterization
  • At least 3 years experience in Far Back End of Line (FBEOL) / 3D Integration / Chip Packaging
  • Experience with fabrication processes

Required and Preferred education levels:

  • BS
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