Ansys HFSS Engineer

PCB Characterization Specialist

We are looking for a highly experienced PCB Interconnect Characterization and Modeling Specialist to join our team. The ideal candidate will have industry experience doing correlation of PCB interconnect measurements with equivalent simulation models in frequency domain. Knowledge of PCB manufacturing artifacts such as copper roughness and how that is accounted for in electromagnetic simulation is a key requirement for this role. Additionally, experience developing and using different fixture removal techniques such as TRL and 2XTHRU schemes (AFR, ISD) are skillsets an ideal candidate will be expected to have.

• Key Responsibilities:
• Perform PCB interconnect simulations with the goal of correlating simulation results with measurements.
• Develop requirements of interconnect structures needed for fixture removal from interconnect lab measurements.
• Collaborate with cross-functional teams to support product development and research projects.
• Stay updated with industry trends and advancements in characterization techniques.

• Qualifications:
• Master's degree in Electrical Engineering or a related field.
• Extensive industry experience in PCB interconnect characterization/measurements.
• Proficiency in electromagnetic simulation of PCB interconnects using Ansys HFSS
• Strong analytical skills and attention to detail.
• Excellent communication and documentation skills.
• Ability to work independently and as part of a team.

• Preferred Skills:PhD in Electrical Engineering.
• Experience with data analysis software.
• Familiarity with industry standards and best practices.
• Proficiency in electromagnetic simulation of PCB interconnects using CST Microwave Studio or Cadence Clarity.
• Knowledge of scripting/GUI design is a nice to have.