Overview
On Site
$180,000 - $200,000
Part Time
Skills
Collaboration
Electrical Engineering
Prototyping
Testing
Artificial Intelligence
New Product Introduction
Job Details
CoWoS Packaging Engineer
Location - Bay Area, CA - Candidate can be relocated to the bay
Position Overview
We are seeking a skilled and motivated CoWoS Packaging Engineer to join our growing team. This role focuses on the development and optimization of Chip-on-Wafer-on-Substrate (CoWoS) packaging technology to support high-performance AI and data center applications. You will collaborate with design, process, manufacturing, and materials teams to enable seamless integration of advanced multi-die packages. If you are passionate about cutting-edge semiconductor packaging and want to help shape the future of AI infrastructure, we d love to hear from you.
Responsibilities
- Develop and optimize CoWoS packaging processes to improve chip performance, power, and reliability
- Collaborate with design, test, and manufacturing teams for seamless chip-package integration
- Drive failure analysis and yield improvements across packaging flows
- Ensure CoWoS packaging meets thermal, mechanical, and electrical performance requirements
- Support new product introduction (NPI), from prototyping to high-volume manufacturing
- Work closely with foundry and OSAT partners (e.g., TSMC, ASE) on process qualification and production ramp-up
Qualifications
- Bachelor s or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
- Minimum 15 years Hands-on experience in advanced semiconductor packaging and interconnect processes
- Hands-on experience in advanced semiconductor packaging and interconnect processes
- Familiarity with CoWoS, InFO, Fan-Out, and 2.5D/3D integration technologies
- Strong understanding of thermal management, reliability testing, and signal/power integrity challenges
- Excellent analytical and problem-solving skills with a proactive, collaborative approach
- Experience working with TSMC and leading OSATs
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