Principal Engineer, Packaging & EDA

Overview

Remote
Depends on Experience
Full Time
No Travel Required

Skills

Packaging

Job Details

Principal Engineer, Packaging & EDA

Fully Remote

Direct Hire/Fulltime

Requirement:

Implementation and roadmap to multi-component and chiplet integration

Own the electronic design automation (EDA) implementation and roadmap for client s multi-component and chiplet integration platforms spanning design kits, simulation tools, and reference ows from concept to deployment.

Lead the technical development of comprehensive process design kits (PDKs) and assembly design kits (ADKs), including modeling, verication, and enablement collateral to accelerate customer adoption technologies.

Collaborate closely with subcontractors to clearly dene Statements of Work (SoW) in quantiable metrics, monitor milestone progress, and adjust deliverables and payable milestones as needed. You will ensure everyone is on the same page and that expectations translate into measurable outcomes.

Act as a hands-on technical authority for EDA packaging workows, bridging electrical, thermal, and mechanical simulation domains. You will represent the client in technical working groups, customer design reviews, and ecosystem partnerships.

Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors (Synopsys, Cadence, Ansys, Siemens) to ensure design enablement ows are aligned, validated, and continuously improved.

Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication. You will deliver predictable outcomes in fast-paced, multi-stakeholder engagements.

Create technical documentation and collateral, including user guides, reference ows, and onboarding materials to support customer design teams and strengthen the position as an EDA innovator.

Monitor EDA market trends and competitive developments, providing actionable insights to guide tool integration, design enablement priorities, and platform diVerentiation.

Champion a culture of accountability and transparency across all program work streams ensuring stakeholders are informed, expectations are managed, and commitments are met.

Required Qualications:

BS in Electrical Engineering, Computer Engineering, or related discipline.

8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workows.

Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design ows for chiplet and heterogeneous integration.

You have built and deployed packaged-related PDKs/ADKs and understand the nuances of modeling, simulation, and qualication across electrical, RF, mechanical, and thermal domains.

Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business audiences.

Startup DNA.You are energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.

Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.

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