Overview
On Site
$50 - $60
Accepts corp to corp applications
Contract - W2
Contract - Independent
Contract - 24 Month(s)
Skills
Package Designer
IC package designs
RF
Netlist
BGA
SI/PI
UCIE
HBM
CoWoS
RDL
Flip Chip
Wire Bond
HDI
Job Details
: Immediate Hiring : : Looking for H1B, -TN, E3, :
Note : Please Share the resume along with LinkedIn....
Position : Package Designer
Location: San Jose, CA
Duration: Long Term
Visa: Any visa (Except OPT)
Experience: 8+ years
We re looking for an experienced Packaging Designer to develop creative and cost-effective IC package designs.
Job Description:
- Netlist & BGA creation
- Substrate stack-up & routing strategy definition
- Experience with RF, Digital, High-speed & Mixed-signal die
- Strong knowledge of SI/PI requirements (DDR, SERDES, etc.)
- Expertise in UCIE (Advanced & Standard), HBM, CoWoS, 2.5D/3D, RDL, Flip Chip, and Wire Bond technologies
- Familiar with HDI substrates, DRC setup, and OSAT rules
- Proficiency in Cadence Allegro Package Designer
Qualification:
- Bachelor s in Electronics/Electrical Engineering
- 5+ years in IC package design & development
NOTE: Please share the resumes along with contact information & VALID LinkedIn URL.
Phani Teja Arruri | Team Lead Kaizen Soft Solutions LLC
e:
M: +1
L: linkedin.com/in/phani-teja-253a0a17b
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