Overview
On Site
USD 225,000.00 - 300,000.00 per year
Full Time
Skills
Artificial Intelligence
Integrated Circuit
Management
Prototyping
Manufacturing
Collaboration
Semiconductors
Security Clearance
2.5D
3D Computer Graphics
Thermal Management
Testing
Electrical Engineering
Materials Science
Mechanical Engineering
Packaging Engineering
Law
Job Details
Piper Companies is seeking a Director of Packaging Engineering - CoWoS to join our dynamic team onsite 5 days per week in Saratoga, CA. The Ideal Director of Packaging Engineering - CoWoS will spearhead the development and refinement of Chip-on-Wafer-on-Substrate packaging technology for high-performance AI and data center applications.
Responsibilities for the Director of Packaging Engineering - CoWoS
Qualifications for the Director of Packaging Engineering - CoWoS:
Compensation/Benefits for the Director of Packaging Engineering - CoWoS:
This job opens for applications on 4/30/2025. Applications for this job will be accepted for at least 30 days from the posting date.
Responsibilities for the Director of Packaging Engineering - CoWoS
- Lead the advancement of CoWoS packaging technology to enhance chip performance, power, and reliability.
- Develop and refine CoWoS packaging processes to ensure superior thermal, mechanical, and electrical performance.
- Work closely with design, test, and manufacturing teams to ensure seamless chip-package integration.
- Implement strategies to enhance yield and address failure modes across packaging flows.
- Oversee the transition from prototyping to high-volume manufacturing, ensuring smooth ramp-up.
- Collaborate with leading foundries and OSAT partners (TSMC, ASE, Amkor, SPIL, etc) on process qualification and production ramp-up.
- Lead and collaborate with various teams to ensure the seamless integration of advanced multi-die packages.
Qualifications for the Director of Packaging Engineering - CoWoS:
- 15+ years of hands-on experience in advanced semiconductor packaging and interconnect processes.
- Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
- Expertise in CoWoS / FOCoS, or FOWLP.
- Proficient in EMIB, InFO, and advanced 2.5D/3D integration technologies
- Strong understanding of thermal management, reliability testing, and signal/power integrity challenges.
- Proven experience working with TSMC and leading OSATs.
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
Compensation/Benefits for the Director of Packaging Engineering - CoWoS:
- Salary Range: $225,000 - $300,000 annually
- Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave if required by law, and Holidays.
This job opens for applications on 4/30/2025. Applications for this job will be accepted for at least 30 days from the posting date.
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