Overview
Skills
Job Details
12+Month Contract
Requirements:
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Semiconductor Process Equipment design in NX (Siemens / former Unigraphics)
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"Machine" designs type background/systems or components of semicon machines/equipment
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2D & 3D CAD Modeling, 3D Printing, Electro-Mechanical Layouts
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Metals, Fixtures, Tooling, Packaging, Mechanisms, Machining/machined parts
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Design knowledge of sheet metal enclosure and machined enclosure development is also required
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DFM (Design For Manufacturing), GD&T (Geometric Dimensioning & Tolerancing), Tolerance Analysis, FEA (Finite Element Analysis)
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Documentation, BOM s
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Teamcenter is Required
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Portfolio or Samples preferred WITH SUBMITTAL ***
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Great Communication Skills
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Able to take direction well
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Team Player type personality/good person to work with
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Able to work in secured and confidential areas
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BSME or Equivalent Degree/Experience
TOP 5 SKILLS REQUIRED:
* NX CAD (Siemens NX) with TeamCenter / Mechanical
* Tooling Design
* Fixtures Design
* Machined parts design
* Mechanisms design