CPU Power Analysis Lead

Summary

Lead power and thermal analysis for CPU subsystems, collaborating across design, SoC, and board teams to optimize power delivery, performance, and efficiency. This role focuses on driving power projections, analysis, and optimization from RTL to silicon.

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Key Responsibilities

• Lead power and thermal analysis using tools like Joules and PTPX.
• Define CPU rail planning and PMIC sizing; optimize PDN with SoC/board teams.
• Develop power vector plans and correlate projections with silicon data.
• Collaborate across RTL, synthesis, and physical design to reduce power.
• Propose power optimization techniques across design stages.

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Qualifications

• 15+ years in ASIC design with deep power analysis expertise.
• Strong scripting (Tcl, Python), analytical, and communication skills.
• Preferred: Experience with UPF/CPF, Verilog, CPU microarchitecture, and thermal analysis.

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Education

• BS + 8 yrs, MS + 7 yrs, or PhD + 6 yrs in EE, CE, CS, or related field.

Determining compensation for this role (and others) at Vaco/Highspring depends upon a wide array of factors including but not limited to the individual’s skill sets, experience and training, licensure and certifications, office location and other geographic considerations, as well as other business and organizational needs. With that said, as required by local law in geographies that require salary range disclosure, Vaco/Highspring notes the salary range for the role is noted in this job posting. The individual may also be eligible for discretionary bonuses, and can participate in medical, dental, and vision benefits as well as the company’s 401(k) retirement plan.