Overview
On Site
$155,000 - $175,000 annually
Full Time
Skills
Research and development
Product development
Profit and loss
Attention to detail
Technical direction
Customer relationship management
Cost reduction
Technical marketing
Strategy
Product management
Financial analysis
Return on investment
Data Analysis
Test methods
Integrated circuit
Sales
Offshoring
Manufacturing
Management
Collaboration
MASS
Planning
Finance
Semiconductors
Assembly
NPV
Organized
Design
Multitasking
Communication
Presentations
Job Details
RESPONSIBILITIES:
Kforce's client, a growing and established nationwide Semiconductor company is seeking a Senior IC Packaging Product Manager (Power IC's) with strong experience in IC Packaging as it relates to Power Semiconductors. We are working directly with the Hiring Manager on these search assignments. This position is hybrid-remote in Chandler, AZ.
Responsibilities:
* The Senior IC Packaging Product Manager (Power IC's) will develop and drive business strategies which increase revenue and gross margin of the power package product line
* Coordinate with Sales, multiple offshore manufacturing sites, and R&D to set technical direction
* Manage customer relationships and gain intimate understanding of customer market and OSAT strategy to grow market share
* Manage individual customer programs and technical issues to resolution through close collaboration with Sales and Factory site
* Promote Company Technology to find potential applications and deploy the packaging portfolio
* Support new product development, qualification, and mass production; This individual will need to help define and manage multiple programs through internal systems, as well as identify and develop new customers
* Align cost reduction activities, standardization, and system/process enhancements with manufacturing sites and customers
* As a Senior IC Packaging Product Manager (Power IC's), you will prepare and communicate technical marketing materials to sales and customers
* Develop an understanding of key competitors and their business/market strategies
* Coordinate with factory planning to drive appropriate levels of capacity, with financial justification, to meet customer demand
* Drive new technical developments through R&D in support of business strategy
REQUIREMENTS:
* Bachelor's or Master's degree in Engineering or similar field; MBA is a plus
* At least 8-10+ years with demonstrated experience in Product Management and P&L within the Semiconductor industry including with IC Packaging
* Prior product management experience involving offshore factory assets and the ability to multiplex across numerous programs and teams is essential
* Strong technical background with knowledge of Packaging Assembly Process technologies required
* Possess an intermediate level of financial analysis understanding and capability, including NPV and ROI analysis
* Highly organized, possess keen attention to detail, possess sense of urgency, and able to successfully manage projects
* Ability to communicate at all levels within Company and customer organizations
* Demonstrated ability to work independently in a heavily matrixed organization and have experience with design and manufacturing systems used in Power packages
* Demonstrated ability to multitask with excellent communication (written and verbal) and presentation skills, working across functional groups as well as cross-culturally
* Ability to deliver technical presentations for customers and at industry seminars
* This position requires approximately 20% domestic and international travel
* Experience with Power Semiconductors is a plus
* Experience in running business product line is desired
* Knowledge of material and package characterization data analysis, test methods and automotive qualification procedures is desired
The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
Kforce's client, a growing and established nationwide Semiconductor company is seeking a Senior IC Packaging Product Manager (Power IC's) with strong experience in IC Packaging as it relates to Power Semiconductors. We are working directly with the Hiring Manager on these search assignments. This position is hybrid-remote in Chandler, AZ.
Responsibilities:
* The Senior IC Packaging Product Manager (Power IC's) will develop and drive business strategies which increase revenue and gross margin of the power package product line
* Coordinate with Sales, multiple offshore manufacturing sites, and R&D to set technical direction
* Manage customer relationships and gain intimate understanding of customer market and OSAT strategy to grow market share
* Manage individual customer programs and technical issues to resolution through close collaboration with Sales and Factory site
* Promote Company Technology to find potential applications and deploy the packaging portfolio
* Support new product development, qualification, and mass production; This individual will need to help define and manage multiple programs through internal systems, as well as identify and develop new customers
* Align cost reduction activities, standardization, and system/process enhancements with manufacturing sites and customers
* As a Senior IC Packaging Product Manager (Power IC's), you will prepare and communicate technical marketing materials to sales and customers
* Develop an understanding of key competitors and their business/market strategies
* Coordinate with factory planning to drive appropriate levels of capacity, with financial justification, to meet customer demand
* Drive new technical developments through R&D in support of business strategy
REQUIREMENTS:
* Bachelor's or Master's degree in Engineering or similar field; MBA is a plus
* At least 8-10+ years with demonstrated experience in Product Management and P&L within the Semiconductor industry including with IC Packaging
* Prior product management experience involving offshore factory assets and the ability to multiplex across numerous programs and teams is essential
* Strong technical background with knowledge of Packaging Assembly Process technologies required
* Possess an intermediate level of financial analysis understanding and capability, including NPV and ROI analysis
* Highly organized, possess keen attention to detail, possess sense of urgency, and able to successfully manage projects
* Ability to communicate at all levels within Company and customer organizations
* Demonstrated ability to work independently in a heavily matrixed organization and have experience with design and manufacturing systems used in Power packages
* Demonstrated ability to multitask with excellent communication (written and verbal) and presentation skills, working across functional groups as well as cross-culturally
* Ability to deliver technical presentations for customers and at industry seminars
* This position requires approximately 20% domestic and international travel
* Experience with Power Semiconductors is a plus
* Experience in running business product line is desired
* Knowledge of material and package characterization data analysis, test methods and automotive qualification procedures is desired
The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.