Overview
On Site
Full Time
Accepts corp to corp applications
Contract - Independent
Contract - W2
Contract - 14 day((s))
Skills
Possess Mentor Graphics
Cadence
package design
Job Details
Requirements/Skills:
- Possess Mentor Graphics, Cadence, PLA knowledge
- Multiple layers package design (8+) experience
- Understanding of substrate manufacturing design rule and assembly rule
- Possess Flip Chip Package Design Concept
- Good communication skill.
- May require vendor on-site support
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