Technical program manager

    • Micron Technology, Inc.
  • Boise, ID
  • Posted 24 days ago | Updated 4 hours ago

Overview

On Site
USD 122,000.00 - 265,000.00 per year
Full Time

Skills

New product introduction
Bill of materials
IT project management
Finite Element Analysis
Design of experiments
Product requirements
Quality assurance
Packaging engineering
Product scoping
Process engineering
Statistics
Functional requirements
Cost reduction
Materials science
Industrial engineering
Problem solving
Failure analysis
Multitasking
Quality management
AutoCAD
Storage
Transformation
Assembly
Design
Marketing
Presentations
Roadmaps
Specification
FMEA
Management
Manufacturing
Procurement
Offshoring
Electrical engineering
Mechanical engineering
Microsoft Excel
JMP
Data
Metrology
Semiconductors
Communication
APD
Cadence
Estimating
Training
Recruiting
Health care
Budget

Job Details

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

PACKAGING TECHNICAL PROGRAM MANAGER

Package & Assembly engineering team in US is responsible for delivering robust, reliable, cost-effective package aligned with the end-product requirements. This involves participation in core teams, co-working with other groups in Micron such as Design, Fab, Marketing, Product and Test Engineering, Package Development and Assembly counter-parts and manufacturers in Asia with respect to design, development, qualification and ramp to meet the deliverables and expectations.

ESSENTIAL DUTIES AND RESPONSIBILITIES: include the following, other duties may be assigned as necessary.

Candidates will be responsible for overall Packaging Engineering portfolio presenting it in front of Business Units and Customers while representing package development and assembly groups and OSASTs with respect to package engineering, quality, reliability, capability, cost and capacity. Thus, candidates will have full responsibility for any aspects of packaging activity in the company representing Package Engineering Group to Business Units and Customers.

The duties include
  • Technology development:
    • New product scoping and definitions and sometimes with immediate support to BUs, and Customers.
    • Define, develop new package requirements, develop Roadmaps, Scope and include Customer requirements in development roadmap along with schedules.
    • Work well in advance on upcoming fab nodes on new die designs to assure that die can be packaged as required in roadmaps, highlight risks with mitigation plans.
    • Work with internal or external suppliers for assembly process development including equipment development as needed.
  • New product Introduction
    • Plans and develop characterization, qualification plans including BLR for new packages for alignment with margin analysis, product reliability & customer specifications
    • Identify Risks and Mitigation Plans with new packages based on customer requirements.
    • Using appropriate tools, performs integrity analysis of packages (includes FMEA, DFX & statistical analysis)
  • Assembly Processes and Materials
    • Prepares and/or updates various packaging & assembly specifications, Bill of Materials and reports if necessary
    • Coordinates with factories worldwide through all product life cycle phases to enable high volume introduction of new packages & assemblies
    • Manage assembly yield improvement reviewing yield loss Pareto analysis
    • Responsible for maintaining package / assembly road map for the product lines supported
    • Extensive knowledge and familiarity with substrate design and substrate manufacturing process, die attach materials (DAF) and Molding compounds
  • Representation
    • Participates in cross-functional teams and ensures that package & assemblies are qualified and introduced into production in a timely manner while meeting all reliability and quality requirements
  • Vendors
    • Working with vendors for materials, processes and equipment for next generation packages.
    • Acts as a liaison while procurement or quality teams work with assembly subcons, substrates and materials vendors
  • Maintains product quality while developing and introducing cost reduction programs


Specific Role Description: Includes the following but not limited to:
  • Highly functional technical program manager of Package Engineering representing in cross-functional teams
  • Represent Packaging in Business Unit meetings and reviews
  • Guide and technical collaborator to offshore factories, OSATs on package and materials development

Minimum Qualifications:
  • Masters or PhD graduate in Electrical, Mechanical, Materials Science or Industrial Engineering, with 10-15 years semi-conductor packaging industry experience
  • Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of the point of diminishing returns
  • Proficient in statistical analysis towards problem solving and the use of Excel and JMP
  • Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution
  • Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition; have high sense of urgency
  • Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques)
  • Strong verbal and written communications skills
  • Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required

Desired Skills:
  • Preferred candidate will have worked on projects related to semiconductor packaging
  • Position requires experience in strong technical project Management
  • Extensive knowledge on FMEA, materials analysis, Quality systems, and reliability tests is required
  • Knowledge of 2nd level solder joint reliability and SI/PI is a plus
  • Understanding of substrate design tools such as APD is a plus
  • Working knowledge of Auto-CAD, Cadence, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required


The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$122,000.00 - $265,000.00

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at or 1- (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.