CAD Engineer with Multiphysics

What You ll Do

• Own and execute hands-on mechanical, thermal, and multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
• Perform thermo-mechanical modeling, warpage analysis, CTE mismatch studies, stress/strain prediction, and thermal management optimization across chiplets, interposers, and substrates.
• Build and validate comprehensive ADK/PDK models (thermal, mechanical, reliability, electrical co-models) that accurately represent package-level behavior and enable system-level co-design.
• Run end-to-end simulation workflows including structural FEA, thermal conduction/convection/radiation, fatigue and delamination reliability, electromigration (EM) & thermal-mechanical co-simulation.
• Collaborate with EDA vendors (Ansys, COMSOL, Siemens, Cadence, Synopsys, Keysight, etc.), OSATs, and foundries to develop and refine thermo-mechanical simulation flows for 2.5D/3DIC packages.
• Generate user guides, reference flows, and automation scripts to make thermal/mechanical/multiphysics enablement repeatable and accessible to design teams.
• Guide technical strategy for thermo-mechanical reliability, mentor junior engineers, and represent TIE in working groups, customer reviews, and industry forums.

Required Qualifications

• BS in Mechanical Engineering, Materials Science, Applied Physics, or related discipline.
• 8+ years (Senior) / 12+ years (Principal) of direct, hands-on experience in thermal-mechanical and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration.
• Strong expertise with FEA/multiphysics tools: Ansys Mechanical/Icepak, COMSOL Multiphysics, Siemens Simcenter, Cadence Celsius, Synopsys RedHawk-SC, CST Studio.
• Proven ability to model and extract thermal conductivity, CTE, Young s modulus, warpage/stress, fatigue, delamination, and reliability metrics, and integrate into design enablement flows.
• Demonstrated experience creating and validating PDK/ADK collateral spanning thermal, mechanical, and reliability domains.
• Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
• Startup DNA. You re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
• Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
• Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30 50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.

Preferred Qualifications

• MS or PhD in Mechanical Engineering, Materials Science, or related discipline.
• Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, underfills, TIMs).
• Expertise in electro-thermal-mechanical co-simulation for high-power/high-bandwidth-density packaging systems.
• Familiarity with JEDEC, IEEE, UCIe, 3Dblox, JEP30 thermal and mechanical reliability standards.
• Experience with advanced cooling approaches: liquid cooling, vapor chambers, microfluidics, TIM3/TIM4 optimization.
• Track record of technical publications, patents, or industry-standard models in thermo-mechanical/multiphysics packaging.