Overview
Skills
Job Details
Title: Physical Design -Integration Engineer
Location: Remote (Preferred - Rochester, MN / Yorktown Heights, NY / Austin, TX)
Duration: 8-12 Months (Possible Extension)
Job Description & Requirements
Your Role and Responsibilities
As a Physical Design Integration Engineer within the Infrastructure organization, you will play a critical role in advancing IBM s cutting-edge quantum chip technologies. Collaborating closely with Research and cross-functional teams, you will be responsible for delivering high-quality digital physical designs against aggressive timelines.
Your primary responsibilities will include:
- End-to-End Physical Design Execution: Own and execute the digital physical design flow from RTL to GDSII using the Cadence tool suite, including Genus (synthesis), Innovus (place and route), and Tempus (timing analysis and closure).
- Design Integration: Integrate and manage complex digital blocks and subsystems, ensuring seamless interaction with analog and quantum components.
- Physical Verification and Signoff: Guide designs through physical checking and verification processes, including DRC, LVS, and other signoff criteria, to ensure manufacturability and compliance with foundry requirements.
- Tapeout Delivery: Drive designs to successful RIT (Release to Tapeout), ensuring all physical and timing signoff requirements are met.
- Collaboration and Communication: Work closely with circuit designers, researchers, and tool developers to resolve design challenges, optimize flows, and ensure alignment across disciplines.
- Problem Solving and Debug: Apply strong analytical and debugging skills to identify and resolve design and flow issues, with a focus on quality and efficiency.
- Continuous Improvement: Contribute to the development and refinement of physical design methodologies, leveraging scripting and automation to enhance productivity and design quality.
- Innovation Support: Engage with emerging technologies and methodologies, including those relevant to quantum computing, to help shape the future of chip design.
This role requires a proactive, detail-oriented engineer with a passion for innovation and a strong foundation in digital physical design. You will be part of a dynamic team pushing the boundaries of what s possible in quantum hardware.
About the Team
The Quantum team is highly technical with a strong record for excellence in delivery and innovation. In addition to local collaboration, these teams interact closely with IBM s multi-site Microprocessor/ASICs and System teams as well as IBM research to enable IBM s Microprocessor/System, Quantum, Storage, and AI roadmaps. This team is primarily based in Rochester, MN and Yorktown, NY but is distributed beyond those geographies.
Required Professional and Technical Expertise
- BS Computer/Electrical Engineering or related
- 5+ years of experience with industry-standard Physical Design tools such as the Cadence tool suite, including Genus, Innovus, & Tempus (e.g. timing closure)
- Knowledge of physical checking and verification (e.g. DRC/LVS)
- Excellent problem-solving skills
- Demonstrated ability to contribute and collaborate effectively within diverse teams
- Strong verbal and written communication skills
- Demonstrated ability to embrace and overcome challenges
- Demonstrated ability to remain adaptable in a dynamic environment
- Demonstrated ability to deliver high-quality deliverables with a strong attention to detail
Preferred Professional and Technical Expertise
- Proficiency in scripting languages (e.g. Python, Tcl, SKILL)
- Ability to develop and deepen skills through continuous learning and a growth mindset
- Demonstrated ability to drive innovation and adopt emerging tools and methodologies
- Transistor-level layout knowledge using tools such as Cadence Virtuoso, and design languages like SKILL
- Bonus: Knowledge of quantum computing