2.5D Jobs in Dallas, TX

1 - 7 of 7 Jobs

Staff SOC Pre-Silicon Verification Engineer - HBM | TPGJob Title - Staff SOC Pre-Silicon Verification Engineer - HBM | TPG

Micron Technology, Inc.Company Name - Micron Technology, Inc.

•

Richardson, Texas, USA

Full-time

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applic

Principal SOC Pre-Silicon Verification Engineer- HBM DesignJob Title - Principal SOC Pre-Silicon Verification Engineer- HBM Design

Micron Technology, Inc.Company Name - Micron Technology, Inc.

•

Richardson, Texas, USA

Full-time

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applic

Staff Engineer - HBM SOC Design and Integration - TPGJob Title - Staff Engineer - HBM SOC Design and Integration - TPG

Micron Technology, Inc.Company Name - Micron Technology, Inc.

•

Richardson, Texas, USA

Full-time

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI

Senior SOC Pre-Silicon Verification Engineer- HBM DesignJob Title - Senior SOC Pre-Silicon Verification Engineer- HBM Design

Micron Technology, Inc.Company Name - Micron Technology, Inc.

•

Richardson, Texas, USA

Full-time

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Opportunity Summary: For more than 43 years, Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team

Principal Engineer - HBM SOC Design and Integration - TPGJob Title - Principal Engineer - HBM SOC Design and Integration - TPG

Micron Technology, Inc.Company Name - Micron Technology, Inc.

•

Richardson, Texas, USA

Full-time

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Opportunity Summary: For more than 43 years, Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team

Microelectronics Advanced Packaging SMEJob Title - Microelectronics Advanced Packaging SME

Booz Allen HamiltonCompany Name - Booz Allen Hamilton

•

Remote

Full-time

Job Number: R0216856 Microelectronics Advanced Packaging SME Key Role: Provide technical leadership and subject matter expertise to U.S. government clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, BGA, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define strategies and

PCB Layout EngineerJob Title - PCB Layout Engineer

Randstad DigitalCompany Name - Randstad Digital

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Remote or Phoenix, Arizona, USA

Contract

job summary: Exciting opportunity for an experienced Principal PCB & Substrate Layout Engineer to join a growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense. The successful candidate will be part of a dynamic team that is transforming the business and the defense-grade microelectronics industry while executing on near-term program commitments while fosteri