Hybrid in San Francisco, California
•
Yesterday
Advanced Packaging Design Engineer PCB / Substrate / 2.5D 3DLocation: Bay Area, CA (Hybrid) | Type: Contract Domain: Semiconductor | AI | High-Performance Computing (HPC) A leading semiconductor and AI-HPC solutions company seeks an experienced Advanced Packaging Design Engineer to drive next-gen package design and technology development for high-performance computing, AI, and networking products. Responsibilities: Lead package/substrate design feasibility for new PCB and interposer technologies
Easy Apply
Contract, Third Party
Depends on Experience