Descriptions & Requirements Job Description and Requirements Synopsys is looking for a 3DIC and Advanced Packaging SIPI architect who will perform SIPI analysis for TSV impact to EMIR, HSIO interference, T-coil performance degradation, and other electrical performance impact to IP and SOC. Work with engineers to do 3DIC design partition, floor planning, TSV placement, mockup design, and silicon interposer/bridge design for Synopsys IP, test chip, and chiplet to meet electrical requirement and o
