Senior Hardware IC Packaging Design Engineer for Chip Design CompanyJob Title - Senior Hardware IC Packaging Design Engineer for Chip Design Company
OSI Engineering, Inc.Company Name - OSI Engineering, Inc.
•Remote
Full-time
Remote
Full-time
Cincinnati, Ohio, USA
Contract
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Marysville, Ohio, USA
Full-time
Remote or Flower Mound, Texas, USA
Full-time
Remote or San Diego, California, USA
Contract
Remote or US
Full-time, Contract
Remote
Full-time
Cincinnati, Ohio, USA
Full-time
Remote
Full-time
US
Contract, Third Party
Remote
Contract
Remote
Full-time
Remote
Contract
Remote or Jacksonville, Florida, USA
Full-time
US
Third Party, Contract
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Remote
Full-time
Remote or Carpinteria, California, USA
Full-time
Remote
Contract