Schneider Electric's Secure Power and Data Center Division is seeking a senior power electronics expert to accelerate the development of next-generation power shelves and rack-level power solutions for AI data centers.
This role combines direct customer technical engagement, power shelf architecture and design, PLECS-based modeling and controls, and hands-on hardware development. The successful candidate will work closely with leading data center customers to define emerging 800VDC white-space power requirements, develop new product concepts, and translate customer needs into technically differentiated design proposals.
What Will You Do?As a member of our cross-functional R&D team at the forefront of developing high-density power converters for AI data center applications, you will:
- Lead technical engagement with data center customers. Drive architecture discussions to understand emerging 800VDC AI data center power requirements, translate evolving customer needs into product requirements, and work with cross-functional teams to develop power shelf architectures, topology proposals, simulations, and technical recommendations.
- Lead customer design reviews. Present proposed architectures, topology trade-offs, PLECS simulation results, control strategies, efficiency and loss analyses, thermal considerations, protection concepts, and validation plans; incorporate customer feedback into the design.
- Lead high-density AC-DC and DC-DC power shelf design. Lead the detailed design and validation of modular high-power 415/480VAC and 800VDC power shelves and rack-level power systems, including three-phase PFC, multilevel, multiphase LLC, Dual Active Bridge, and other advanced converter topologies.
- Develop advanced PLECS control models. Create switching, averaged, small-signal, loss, and thermal models; derive transfer functions; design and analyze control and current-sharing loops; and perform loop-gain, stability, impedance, and transient-response analysis.
- Drive high-power-density hardware and loss optimization. Apply SiC and GaN technologies and optimize semiconductors, gate drives, high-frequency magnetics, sensing, protection, busbars, and high-current interconnections. Perform detailed semiconductor, magnetics, interconnect, and system-level loss analysis.
Required Qualification- Master's degree or PhD in Power Electronics, Electrical Engineering, or a related discipline, with 7+ years of relevant industry experience.
- Demonstrated experience designing high-power-density AC-DC and DC-DC converters, modular power supplies, or power shelves, including topology selection, detailed design, and hardware validation.
- Advanced proficiency with PLECS and power converter control modeling, including switching and small-signal modeling, loop compensation, stability, impedance, transient response, and loss analysis.
- Hands-on design experience with SiC/GaN devices, gate drives, high-frequency magnetics, sensing, protection, thermal management, and high-current power interconnects.
- Demonstrated ability to translate customer requirements into technical architectures and lead customer-facing technical discussions and design reviews.
- Ability to work onsite in the Greater Boston area and travel as needed for customer and engineering engagements.
Preferred Qualification- Direct experience developing power shelves, power racks, or rack-level power systems for AI or hyperscale data centers, including 415/480VAC, 50VDC and emerging 800VDC architectures.
- Deep knowledge of advanced power converter topologies, including three-phase PFC, multilevel multiphase LLC, Dual Active Bridge converters, and other high-power-density AC-DC/DC-DC topologies.
- Strong experience with advanced converter modeling and control analysis, including small-signal models, loop-gain measurement, impedance modeling, converter interaction, stability analysis, and simulation-to-hardware correlation.
- Understanding of AI GPU/accelerator load profiles, rapid load transients, peak power shaving, rack-level energy storage, and their interaction with upstream power converters.
- Experience with liquid-cooled, high-power-density power electronics, including electrical/thermal co-optimization.
- Experience working directly with hyperscale data center operators, compute-platform companies, server OEMs/ODMs, or semiconductor and technology partners.
Bring your hardware design expertise to a team that's ready to innovate with you-apply today!
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For this U.S. based position, the expected pay range is USD 101,600 - USD 152,400 per year. This pay range includes base pay and short-term incentives. The compensation range for this full-time position applies to candidates located within the United States. Our pay ranges are determined by reviewing roles of similar responsibility and level. Within the pay range, individual pay is determined by several factors including performance, knowledge, job-related skills, experience, and relevant education or training.
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