Company:Qualcomm Technologies, Inc.
Job Area:Engineering Group, Engineering Group > ASICS Engineering
General Summary:Job Description
Qualcomm is the world's largest fabless design company, delivering cutting-edge hardware, software, and services to nearly every mobile device maker and operator in the global wireless ecosystem.
At the heart of Qualcomm's multi-tier mobile SoC, Server, IoT, and Automotive roadmap are our high-performance, multithreaded, low-power Hexagon cores. These cores power a wide range of applications-from AR/XR, audio, and modem to machine learning and automotive. You'll be working on industry-leading modem and AI cores, driving innovation across instruction sets, RTOS, software architecture, microarchitecture, power, thermal, and di/dt challenges.
We're looking for a motivated and talented engineer to join our team and contribute to the development of high-performance, energy-efficient CPU cores. Ideal candidates will have experience in CPU microarchitecture and RTL design, with knowledge in one or more of the following areas:
- Processor pipelines
- Out-of-order execution
- Load/store units
- Caches and cache coherence
- Memory hierarchy
- Multi-processor and multi-threaded systems
- RISC-V architecture
You will own microarchitecture and RTL development, including low-power optimizations, performance exploration, and achieving area and timing goals. Strong communication, collaboration, and teamwork skills are essential.
Are you passionate about design and solving complex, challenging problems?
Join our Hexagon team-creators of over 20 billion cores-with a proven track record of innovation and flawless execution.
Qualifications:- Master's degree in Computer Science, Electrical Engineering, or a related field
- 1-3 years of experience in CPU architecture and RTL design
Minimum Qualifications: Bachelor's degree in Science, Engineering, or related field.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits: $98,500.00 - $147,700.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
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