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THE ROLE: Join a global product reliability team that drives product qualifications for the next generation Datacenters and Servers, leveraging advanced silicon and packaging technologies. This position is a highly visible role within the AMD engineering team and is responsible for developing end-to-end Hardware and Software solutions for High Temperature Operating Life (HTOL) and Burn-in test to characterize silicon reliability behavior for new products to align with AMD product and customer requirements. The position provides influence that mandates strong technical and analytical skills.
THE PERSON: - This role focuses on end-to-end ownership for designing BIB (Burn-In Board) hardware and developing stress/test programs specifically optimized for the MCC test platform as well as other Burn-in platforms.
- A self-motivated team player who focuses on collaboration, team building, and expanding team success.
KEY RESPONSIBILITIES: - Starting in early product development cycle, collaborating with cross-functional teams to design custom High-Power Burn-In Boards (BIBs) for CPU and GPUs.
- Interface with PCB fabrication and socket manufacturers to guide board development.
- Establish HTOL/BI pattern requirements for development of stress programs and work with design validation and product engineering teams to bring-up burn-in DFT patterns.
- Integrate patterns into stress programs, debug, and maintain reliability test code, utilizing the native MCC C-Breez environment or associated platform software.
- Lead hardware validation of First Article boards for HTOL and Burn-in, debug hardware and PNP software issues.
- Communicate with offshore factories and reliability labs during HTOL/BI hardware and test program brin-up.
- Conduct test data analysis Pre/Post Burn-in experiments to identify opportunities for test program optimization. Create data-logging scripts to capture parametric drift, test logs, and qualification metrics.
- Expanded role to support ESD and Latch-up hardware and stress program development.
PREFERRED EXPERIENCE: - Knowledge of HTOL/BI board schematics, layout and PCB development to define requirements.
- Knowledge of HTOL/BI DFT pattern architecture, pattern vector timing.
- Hands-on experience of programming such as Python/C++/SQL and scripting language.
- Knowledge of test pattern architecture, vector translation, vector timing diagrams and developing programs to enable HTOL/BI stress testing.
- Experience in Product Reliability Engineering, with exposure to Product Engineering, Test, HTOL/BI environment and test methodology.
- Experience with oscilloscope and logic analyzer equipment to debug Burn-in-Boards.
- Knowledge of Computer and processor Architecture concepts, a plus.
- Knowledge of modeling techniques to develop DOE experiments for Burn-in optimization, a plus.
- Knowledge of device degradation models for production guardbands, a plus.
- Strong communication skills including data presentation.
ACADEMIC CREDENTIALS: - BS or MS in Electrical Engineering, Computer Engineering or equivalent.
This role is not eligible for visa sponsorship.#LI-CJ2
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's "Responsible AI Policy" is available here.
This posting is for an existing vacancy.
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