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Photolithography Process Engineer

Broadcom Corporation

Fort Collins, Colorado • Today

Full-time

USD 109,700.00 - 175,500.00 per year

Dry Etch Process Develop Engineer

Micron Technology, Inc.

Remote or Albany, New York • Today

Full-time

USD 107,000.00 - 182,000.00 per year

Job Details

Skills

Wireless Communication
Semiconductors
Word-sense Disambiguation
Management
Continuous Delivery
Application Development
Equipment Maintenance
Leadership
Design Of Experiments
Process Engineering
Process Improvement
Materials Science
Science
Physics
Chemistry
Photolithography
Process Control
Optimization
FOCUS
Research and Development
MEMS
Statistical Process Control
Manufacturing
Data Analysis
JMP
Minitab
TIBCO Spotfire
Microsoft Excel
Customer Engagement
TPS
Lean Methodology
Communication
Multitasking
Collaboration
Teamwork
Attention To Detail
Legal
Authorization
Law

Wireless Communication
Semiconductors
Word-sense Disambiguation
Management
Continuous Delivery
Application Development
Equipment Maintenance
Leadership
Design Of Experiments
Process Engineering
Process Improvement
Materials Science
Science
Physics
Chemistry
Photolithography
Process Control
Optimization
FOCUS
Research and Development
MEMS
Statistical Process Control
Manufacturing
Data Analysis
JMP
Minitab
TIBCO Spotfire
Microsoft Excel
Customer Engagement
TPS
Lean Methodology
Communication
Multitasking
Collaboration
Teamwork
Attention To Detail
Legal
Authorization
Law

Summary

Please Note:

1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)

2. If you already have a Candidate Account, please Sign-In before you apply.

Job Description:

Description

As a Photolithography Engineer with the Wireless Semiconductor Division (WSD), you will develop and sustain new and enabling unit processes in our existing high volume Si MEMS production facilities located along the Front Range Mountains in Northern Colorado. You will team with Technology Development and Equipment Engineering to achieve this objective. The team will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping them into high volume manufacturing. We are looking to hire a talented, highly motivated engineer responsible for challenging and rewarding work.

Responsibilities:

Development and characterization of robust solutions to R&D needs in collaboration with development engineering groups.
Combination of layer and process tool ownership. Responsible for managing CD and overlay SPC charts, along with layer defect monitoring.
Ownership of photo processes on ASML i-line steppers and high-topography exposure systems for MEMS Silicon based technologies. This will include sustaining high volume manufacturing lines, as well as some new processes, materials, and applications development.
Yield, quality and cost improvements to existing unit processes, to deliver highly robust and consistent results in collaboration with equipment maintenance and operational organizations.
Collaborate with Equipment Engineering and R&D to conceptualize and progress opportunities that enable continued technological leadership, working across roles & teams, both internal and external, to deliver benefit to the business.
Experimental design and data analysis to support the line sustaining work, process development and process improvements. Solid identification and resolution of yield and defect issues with clear communication of results across the organization.
Organizes and manages long-term improvement projects to meet organizational goals. Work with peers and the equipment engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects.
Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).

Qualifications:

BS (MS or higher preferred) in EE, ME, ChE, Materials Science, Physics or Chemistry and 8+ years of related experience. Or MS in EE, ME, ChE, Material Sciences, Physics or Chemistry and 6+ years related experience. Or PhD in EE, ME, ChE, Material Sciences, Physics or Chemistry and 3+ years of related experience
Expertise in photolithography, this position designed for highly autonomous experts. This is not an entry level position.
Proficiency in a wide variety of photolithography tools. Experience with TEL_ACT8 and PAS5500 equipment is highly desirable. Experience with Wafer-Level Packaging (WLP), through silicon vias (TSVs), or thick resist processing (e.g. polyimides, chem amp resists, etc.) is desirable
- Exposure Focus: Deep experience with ASML equipment (PAS5500), advanced process control, overlay optimization, and i-line steppers.
- Track Focus: Deep track background (TEL_ACT8) focused on R&D, new layer development, and new resist materials selection.
Expertise in engineering fundamentals for all areas of fab processing
Understanding of general processing techniques and concepts for silicon-based MEMS devices applications including interdependencies with other unit processes.
Strength in Statistical Process Control for a high-volume manufacturing facility. Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access is required.
Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.
Proven ability to work in a dynamic environment and deliver results.
Strong troubleshooting skills.
Excellent ownership, initiative and communication skills.
Track record of self-motivated and collaborative learning.
Ability to prioritize and multitask.
Strong cross functional teamwork skills and demonstrated ability to deliver improvements within a team environment.
Attention to detail is essential.
Legal authorization to work in the U.S. is required.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $109,700 - $175,500

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.

Dice Id: 10107597
Position Id: 4bb18ce5655fb29c31551f30cdd5cb72
Posted 30+ days ago

Fitment

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Job Details

Skills

Wireless Communication
Semiconductors
Word-sense Disambiguation
Management
Continuous Delivery
Application Development
Equipment Maintenance
Leadership
Design Of Experiments
Process Engineering
Process Improvement
Materials Science
Science
Physics
Chemistry
Photolithography
Process Control
Optimization
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Research and Development
MEMS
Statistical Process Control
Manufacturing
Data Analysis
JMP
Minitab
TIBCO Spotfire
Microsoft Excel
Customer Engagement
TPS
Lean Methodology
Communication
Multitasking
Collaboration
Teamwork
Attention To Detail
Legal
Authorization
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Wireless Communication
Semiconductors
Word-sense Disambiguation
Management
Continuous Delivery
Application Development
Equipment Maintenance
Leadership
Design Of Experiments
Process Engineering
Process Improvement
Materials Science
Science
Physics
Chemistry
Photolithography
Process Control
Optimization
FOCUS
Research and Development
MEMS
Statistical Process Control
Manufacturing
Data Analysis
JMP
Minitab
TIBCO Spotfire
Microsoft Excel
Customer Engagement
TPS
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Communication
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Teamwork
Attention To Detail
Legal
Authorization
Law

Summary

Development and characterization of robust solutions to R&D needs in collaboration with development engineering groups.
Combination of layer and process tool ownership. Responsible for managing CD and overlay SPC charts, along with layer defect monitoring.
Ownership of photo processes on ASML i-line steppers and high-topography exposure systems for MEMS Silicon based technologies. This will include sustaining high volume manufacturing lines, as well as some new processes, materials, and applications development.
Yield, quality and cost improvements to existing unit processes, to deliver highly robust and consistent results in collaboration with equipment maintenance and operational organizations.
Collaborate with Equipment Engineering and R&D to conceptualize and progress opportunities that enable continued technological leadership, working across roles & teams, both internal and external, to deliver benefit to the business.
Experimental design and data analysis to support the line sustaining work, process development and process improvements. Solid identification and resolution of yield and defect issues with clear communication of results across the organization.
Organizes and manages long-term improvement projects to meet organizational goals. Work with peers and the equipment engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects.
Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).

Qualifications:

BS (MS or higher preferred) in EE, ME, ChE, Materials Science, Physics or Chemistry and 8+ years of related experience. Or MS in EE, ME, ChE, Material Sciences, Physics or Chemistry and 6+ years related experience. Or PhD in EE, ME, ChE, Material Sciences, Physics or Chemistry and 3+ years of related experience
Expertise in photolithography, this position designed for highly autonomous experts. This is not an entry level position.
Proficiency in a wide variety of photolithography tools. Experience with TEL_ACT8 and PAS5500 equipment is highly desirable. Experience with Wafer-Level Packaging (WLP), through silicon vias (TSVs), or thick resist processing (e.g. polyimides, chem amp resists, etc.) is desirable
- Exposure Focus: Deep experience with ASML equipment (PAS5500), advanced process control, overlay optimization, and i-line steppers.
- Track Focus: Deep track background (TEL_ACT8) focused on R&D, new layer development, and new resist materials selection.
Expertise in engineering fundamentals for all areas of fab processing
Understanding of general processing techniques and concepts for silicon-based MEMS devices applications including interdependencies with other unit processes.
Strength in Statistical Process Control for a high-volume manufacturing facility. Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access is required.
Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.
Proven ability to work in a dynamic environment and deliver results.
Strong troubleshooting skills.
Excellent ownership, initiative and communication skills.
Track record of self-motivated and collaborative learning.
Ability to prioritize and multitask.
Strong cross functional teamwork skills and demonstrated ability to deliver improvements within a team environment.
Attention to detail is essential.
Legal authorization to work in the U.S. is required.

Dice Id: 10107597
Position Id: 4bb18ce5655fb29c31551f30cdd5cb72
Posted 30+ days ago

Fitment

Dice Job Match Score™

🔢 Crunching numbers...

Create job alert

Never miss an opportunity! Create an alert based on the job you applied for.

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