Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location - employees join together to improve the world.
Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.
Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.
Are you bold thinking? Find your place on our team and help us change the world!
Primary Objective: We are seeking an Equipment Engineer to join the team in Florida.
Major Areas of Accountability:- Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Advanced Packaging processes including Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Singulation, Photolithography, Solder Bumping, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined).
- Work with process engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions and eliminate chronic and long-term down events.
- Lead continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk.
- Complete new tool start-up and tool upgrades to increase fab capability, capacity, lower costs and improve yields.
- Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
- Participate in cross-functional teams that create efficiencies across all layers of the organization.
- The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required QualificationsEducation: Bachelor of Science or in Mechanical, Electrical or Chemical Engineering, Materials Science, Physics or other relevant Engineering discipline.
Experience and/or Training:- 2-5 years of related experience
- Experience with High Vacuum and Toxic Gas Delivery systems.
- Experience with application of structured problem-solving methodology.
- Positive interpersonal skills, highly energetic and self-motivated.
- Outstanding written and verbal communication skills.
- Demonstrated ability to meet requirements and deliver results.
- Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.
ship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Preferred Qualifications:- Experience with wafer/die bonding equipment and/or processes
- Experience with Automated Fault Detection and Classification Systems (FDC).
- Background with utilizing SPC.
- Understanding of equipment component behavior.
- Experience Integrating Equipment Maintenance Management Software
The annual salary range for this role is $79,440 - $119,160. Pay offered is based on many factors, including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well as other employee financial benefits, including 401k match, and life insurance.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at or
EOE, including disability/vetsWe will never ask applicants to pay fees, purchase equipment or gift cards, or provide financial information before a formal offer of employment has been accepted. If you receive a suspicious communication claiming to represent our company, please verify its authenticity by contacting our recruitment team at before responding.
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