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Job Details

Skills

Tape-Out
IC Design
Semiconductor
Sign-Off
EDA
Physical Verification

Summary

We’re hiring for a full-time opportunity with a leading semiconductor R&D organization in USA. For the role of Senior Tape-Out Support Engineer – Semiconductor.. Detailed job description is given below.

Senior Tape-Out Support Engineer – Semiconductor

Location: Lafayette, Indiana

Type: Full-Time

Experience: 7+ Years

Role Overview

We are seeking a Senior Tape-Out Support Engineer to support semiconductor customers through the IC tape-out, sign-off, and fabrication process. The role requires strong semiconductor/IC design knowledge along with customer and foundry coordination experience.

Key Responsibilities

Support customers throughout the tape-out, sign-off, and fabrication preparation process.
Review and validate customer designs using EDA tools and ensure compliance with foundry requirements.
Coordinate with IC design, layout, engineering, and foundry teams to identify and resolve technical issues.
Serve as the primary technical contact for customers, providing foundry information, documentation, guidance, and issue resolution.
Work with foundry partners on technical specifications, process requirements, exceptions, and tape-out schedules.
Track tape-out milestones and provide technical support to sales/business development and project teams.

Required Skills

7+ years of experience in semiconductor/IC engineering.
Strong understanding of IC design, tape-out, sign-off, and semiconductor manufacturing.
Experience with foundry processes, PDKs, design rules, and EDA tools.
Experience with DRC/LVS or physical verification is preferred.
Strong customer-facing and cross-functional communication skills.
Experience working directly with semiconductor foundries is highly preferred.

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.

Dice Id: 91017688
Position Id: 329-16084-1790347466
Posted 9 days ago

Company Info

About SolGenie Technologies, INC

SolGenie is a digital solutions partner for innovative consulting, technology, and outsourcing services with 12 years of experience in delivering customized IT solutions and software services to enterprises to solve business problems while enhancing their competitive edge.

We are professionals in tackling business problems that large enterprises seek to solve with unique digital solutions. Our capabilities span Mobility, Advanced Analytics and Artificial Intelligence, Cloud services, Internet of Things and Intelligent Automation, E-business solutions, ERP implementations, global roll-outs, upgrades, testing, application management and infrastructure support.

We offer our services in a variety of consumption models (fixed fee per project, pay as you go etc) and commercial models (fee for service, managed service, fixed bid etc) that fit the balance sheet and/or P&L priorities of our customers.

We believe strongly that our customers can obtain the best value if we are engaged in a fixed bid model. We prefer not to be engaged on a resources-based model but we do recognize that true partners have to be flexible, and should keep the customer’s priorities first.

Job Details

Skills

Tape-Out
IC Design
Semiconductor
Sign-Off
EDA
Physical Verification

Summary

Senior Tape-Out Support Engineer – Semiconductor

Location: Lafayette, Indiana

Type: Full-Time

Experience: 7+ Years

Role Overview

Key Responsibilities

Support customers throughout the tape-out, sign-off, and fabrication preparation process.
Review and validate customer designs using EDA tools and ensure compliance with foundry requirements.
Coordinate with IC design, layout, engineering, and foundry teams to identify and resolve technical issues.
Serve as the primary technical contact for customers, providing foundry information, documentation, guidance, and issue resolution.
Work with foundry partners on technical specifications, process requirements, exceptions, and tape-out schedules.
Track tape-out milestones and provide technical support to sales/business development and project teams.

Required Skills

7+ years of experience in semiconductor/IC engineering.
Strong understanding of IC design, tape-out, sign-off, and semiconductor manufacturing.
Experience with foundry processes, PDKs, design rules, and EDA tools.
Experience with DRC/LVS or physical verification is preferred.
Strong customer-facing and cross-functional communication skills.
Experience working directly with semiconductor foundries is highly preferred.

Dice Id: 91017688
Position Id: 329-16084-1790347466
Posted 9 days ago

Company Info

About SolGenie Technologies, INC

ASIC Physical Design Engineer

Lafayette, Indiana

•

17d ago

Were hiring for a full-time opportunitywith a leading semiconductor end client in Lafayette, IN. Seeking experienced ASIC Physical Design / Backend Engineers with strong TSMC FinFET tapeout and signoff experience.. Detailed job description is given below. Title:ASIC Physical Design Engineer (TSMC / FinFET) Location: Lafayette, Indiana (Relocation assistance provided) Type: Full time with Client Tapeout , Signoff , DRC/LVS/PEX,Customer interaction Job Responsibilities: Act as the primary inter

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Full-time, Third Party

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Tape-Out Support Engineer – Semiconductor

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Summary

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Tape-Out Support Engineer – Semiconductor

SolGenie Technologies, INC

Job Details

Skills

Summary

Company Info

About SolGenie Technologies, INC

Dice Job Match Score™

Similar Jobs