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Failure Analysis Engineer III

Rochester Electronics, LLC

Newburyport, Massachusetts • Today

Full-time

USD 94,000.00 per year

Senior Failure Analysis Engineer, Medium Voltage Transformers and Switchgear

SMA America, Inc.

Remote • Today

Full-time

USD 106,000.00 - 150,000.00 per year

Engineer III, Vulnerability Management

Cencora

Remote or Philadelphia, Pennsylvania • Today

Full-time

Forensic Structural Engineer III, Cleveland, OH

Salas O'Brien Engineers Incorporated

Remote • Today

Full-time

USD 115,000.00 - 185,000.00 per year

Security Analyst III

Opusing One, LLC

Remote • 10d ago

Easy Apply

Contract

80 - 90

Engineer IV - VI, Nuclear Safety Analysis

X-energy

Remote or Rockville, Maryland • Today

Full-time

USD 112,000.00 - 166,000.00 per year

Engineer III-IV, Engineering Strategy

X-energy

Remote or Rockville, Maryland • Today

Full-time

USD 107,495.00 - 179,159.00 per year

Forensic Structural Engineer III, Chicago

Salas O'Brien Engineers Incorporated

Remote or Illinois • Today

Full-time

USD 125,000.00 - 185,000.00 per year

Job Details

Skills

Debugging
Leadership
Investments
ICS
Microprocessor
Access Control
Test Equipment
Microscopy
Material Characterization
Software Asset Management
Scanning Electron Microscope
SEM
EDS
Mechanical Engineering
Manufacturing
Assembly
SAP BASIS
Testing
Failure Analysis
Multitasking
Research
ROOT
Root Cause Analysis
Layout
Mixed-signal Integrated Circuit
ASIC
Physics
Semiconductor Fabrication
FIB
Organized
Attention To Detail
Conflict Resolution
Problem Solving
Customer Service
Communication
Training
Supervision
Management
Collaboration
Quality Assurance
Electrical Engineering
Semiconductors
Integrated Circuit

Debugging
Leadership
Investments
ICS
Microprocessor
Access Control
Test Equipment
Microscopy
Material Characterization
Software Asset Management
Scanning Electron Microscope
SEM
EDS
Mechanical Engineering
Manufacturing
Assembly
SAP BASIS
Testing
Failure Analysis
Multitasking
Research
ROOT
Root Cause Analysis
Layout
Mixed-signal Integrated Circuit
ASIC
Physics
Semiconductor Fabrication
FIB
Organized
Attention To Detail
Conflict Resolution
Problem Solving
Customer Service
Communication
Training
Supervision
Management
Collaboration
Quality Assurance
Electrical Engineering
Semiconductors
Integrated Circuit

Summary

Description

Experienced Sr. Electrical Failure Analysis Engineer to perform debug, fault isolation, and root cause analysis of prototype and production devices. The candidate will have the experience in Semiconductor FA to help guide lower level Engineers through the process and have the knowledge and Leadership to justify lab investments for us to strive to be "Best in Class"

Responsibilities

Perform electrical verification and fault isolation on highly complex ICs (Analog, Digital, ASICs, Microprocessors, etc.) in package, die, or wafer form to determine the failure mechanism.
High level understanding of FA tools demonstrating beginning subject matter expertise requiring little supervision.
Replicate ATE test data on the manual FA bench using ATE datalogs, product datasheets, curve tracers, parametric analyzers, AC/DC test equipment, and collaborate with product and test engineers.
Works on more complex assignments where judgement and initiative are required and acts as a quality agent and drives others to a quality mindset.
Ability to gather and interpret PEM (photon emission microscopy), TIVA (Thermal Induced Voltage Alterations) and Thermal hot spot data and drive to the correct failure location using CAD design data.
Performs material characterization of the failure mechanism (SAM, X-RAY, SEM, EDS, cross-sections, etc.) to assist with root cause analysis.
Performs decapsulation of various packages including hermetic and plastic molded packages utilizing various techniques such as chemical, laser and mechanical methods.
Performs deprocessing of die or wafers using a combination of chemical, mechanical or RIE etching. Must be able to work with caution and safety in mind while working with chemicals and physical de-processing with an attention to detail.
Works closely with the Manufacturing organization, Assembly, Product, and Test Engineering to understand the organizations goals and help them meet all requirements and deadlines, by turning around FA requests in a timely manner.
Work in a hands-on position where the individual will be doing the majority of their work on an independent basis.

Additional Responsibilities

Perform installations of FA equipment and coordinates maintenance and testing procedures to ensure proper working order of FA tools.
Proactively writes and maintains Failure Analysis Lab procedures. Effectively compiles comprehensive DPA construction analysis reports.
Identifies and addresses potential areas for improvement including tools, cycle time, utilization and cost.
Helps management prioritize the job queue and maintain alignment with department goals.
Mentors and guides junior analysts on lab tools and techniques.
Able to handle several active projects at one time (multitask) with some assistance or instruction. Able to conduct research and develop new capabilities based on project needs.

Qualifications

Bachelor's degree in Electrical Engineering, Microelectronics, or related engineering degree.
At least 5 years of experience performing electrical fault isolation and root cause identification. bility to verify the electrical failure mode and identify the failure mechanism. Help the customer with root cause analysis.

Proven skills

- Advanced knowledge of semiconductor products, device layout, and process technologies.
- Advanced knowledge and understanding of analog, mixed signal, Asic, and power semiconductor operation.
- Solid understanding of device physics and semiconductor fabrication techniques. Knowledge or experience with available techniques and when to apply (EMMI, FIB, microprobing)
- Must be very organized, detail oriented, had have proven problem-solving skills.
- Ability to work independently, self-starter with little supervision.
- Proactive and self-motivated. Driven to achieve goals in a fast-paced customer service environment.

Communication

- Proficient verbal and written communications skills, with ability to foster timely and transparent communication with peers and customers.
- Follows written and verbal instruction with some supervision.
- Proactively shares timely updates with peers, customers and management.
- Thinks and plans ahead to mitigate unexpected outcomes.

Team

- Ability to work within a team and as an individual contributor with autonomy in a fast-paced, changing environment.
- Drive collaboration with cross functional teams (ASL, MFG, QA, REL, Test) to solve more complex electrical and materials analysis investigations of semiconductor integrated circuit failures.
- Mentors junior analysts

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.

Dice Id: RTL739290
Position Id: cbbadaf841565bb3d78b38240af14e91
Posted 30+ days ago

Fitment

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Job Details

Skills

Debugging
Leadership
Investments
ICS
Microprocessor
Access Control
Test Equipment
Microscopy
Material Characterization
Software Asset Management
Scanning Electron Microscope
SEM
EDS
Mechanical Engineering
Manufacturing
Assembly
SAP BASIS
Testing
Failure Analysis
Multitasking
Research
ROOT
Root Cause Analysis
Layout
Mixed-signal Integrated Circuit
ASIC
Physics
Semiconductor Fabrication
FIB
Organized
Attention To Detail
Conflict Resolution
Problem Solving
Customer Service
Communication
Training
Supervision
Management
Collaboration
Quality Assurance
Electrical Engineering
Semiconductors
Integrated Circuit

Debugging
Leadership
Investments
ICS
Microprocessor
Access Control
Test Equipment
Microscopy
Material Characterization
Software Asset Management
Scanning Electron Microscope
SEM
EDS
Mechanical Engineering
Manufacturing
Assembly
SAP BASIS
Testing
Failure Analysis
Multitasking
Research
ROOT
Root Cause Analysis
Layout
Mixed-signal Integrated Circuit
ASIC
Physics
Semiconductor Fabrication
FIB
Organized
Attention To Detail
Conflict Resolution
Problem Solving
Customer Service
Communication
Training
Supervision
Management
Collaboration
Quality Assurance
Electrical Engineering
Semiconductors
Integrated Circuit

Summary

Perform electrical verification and fault isolation on highly complex ICs (Analog, Digital, ASICs, Microprocessors, etc.) in package, die, or wafer form to determine the failure mechanism.
High level understanding of FA tools demonstrating beginning subject matter expertise requiring little supervision.
Replicate ATE test data on the manual FA bench using ATE datalogs, product datasheets, curve tracers, parametric analyzers, AC/DC test equipment, and collaborate with product and test engineers.
Works on more complex assignments where judgement and initiative are required and acts as a quality agent and drives others to a quality mindset.
Ability to gather and interpret PEM (photon emission microscopy), TIVA (Thermal Induced Voltage Alterations) and Thermal hot spot data and drive to the correct failure location using CAD design data.
Performs material characterization of the failure mechanism (SAM, X-RAY, SEM, EDS, cross-sections, etc.) to assist with root cause analysis.
Performs decapsulation of various packages including hermetic and plastic molded packages utilizing various techniques such as chemical, laser and mechanical methods.
Performs deprocessing of die or wafers using a combination of chemical, mechanical or RIE etching. Must be able to work with caution and safety in mind while working with chemicals and physical de-processing with an attention to detail.
Works closely with the Manufacturing organization, Assembly, Product, and Test Engineering to understand the organizations goals and help them meet all requirements and deadlines, by turning around FA requests in a timely manner.
Work in a hands-on position where the individual will be doing the majority of their work on an independent basis.

Additional Responsibilities

Perform installations of FA equipment and coordinates maintenance and testing procedures to ensure proper working order of FA tools.
Proactively writes and maintains Failure Analysis Lab procedures. Effectively compiles comprehensive DPA construction analysis reports.
Identifies and addresses potential areas for improvement including tools, cycle time, utilization and cost.
Helps management prioritize the job queue and maintain alignment with department goals.
Mentors and guides junior analysts on lab tools and techniques.
Able to handle several active projects at one time (multitask) with some assistance or instruction. Able to conduct research and develop new capabilities based on project needs.

Qualifications

Bachelor's degree in Electrical Engineering, Microelectronics, or related engineering degree.
At least 5 years of experience performing electrical fault isolation and root cause identification. bility to verify the electrical failure mode and identify the failure mechanism. Help the customer with root cause analysis.

Proven skills

- Advanced knowledge of semiconductor products, device layout, and process technologies.
- Advanced knowledge and understanding of analog, mixed signal, Asic, and power semiconductor operation.
- Solid understanding of device physics and semiconductor fabrication techniques. Knowledge or experience with available techniques and when to apply (EMMI, FIB, microprobing)
- Must be very organized, detail oriented, had have proven problem-solving skills.
- Ability to work independently, self-starter with little supervision.
- Proactive and self-motivated. Driven to achieve goals in a fast-paced customer service environment.

Communication

- Proficient verbal and written communications skills, with ability to foster timely and transparent communication with peers and customers.
- Follows written and verbal instruction with some supervision.
- Proactively shares timely updates with peers, customers and management.
- Thinks and plans ahead to mitigate unexpected outcomes.

Team

- Ability to work within a team and as an individual contributor with autonomy in a fast-paced, changing environment.
- Drive collaboration with cross functional teams (ASL, MFG, QA, REL, Test) to solve more complex electrical and materials analysis investigations of semiconductor integrated circuit failures.
- Mentors junior analysts

Dice Id: RTL739290
Position Id: cbbadaf841565bb3d78b38240af14e91
Posted 30+ days ago

Fitment

Dice Job Match Score™

To see how well you match this job, please log in or create an account.

Once logged in, be sure to complete your profile to get the most accurate match score.

Create job alert

Never miss an opportunity! Create an alert based on the job you applied for.

Similar Jobs

Failure Analysis Engineer

Manchester, New Hampshire

•

Today

Full-time

Failure Analysis Engineer

Cambridge, Massachusetts

•

Today

Full-time

USD 90,000.00 - 180,000.00 per year

Reliability Test and Failure Analysis Engineer

Beverly, Massachusetts

•

Today

Full-time

USD 156,685.60 - 235,028.40 per year

Systems Applications Engineer (Electrical / Hardware)

Manchester, New Hampshire

•

Today

The Allegro team is united by a clear purpose-advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business-from breakthrough product development and customer success to how we show up for each other and the communities we serve. The Opportunity Allegro MicroSystems is seeking an enthusiastic, analytical Systems Engineer to join our global engi

Full-time