Job Title: Principal Thermal & Multiphysics Engineer
Posting Start Date: 9/15/26
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Description:
Job OverviewAs a Principal Thermal & Multiphysics Engineer in the Mechanical Center of Excellence team, you will lead advanced thermal research, thermal predictive analysis and validation efforts for cutting-edge interconnect systems used in AI data centers, high-performance computing, and next-generation communication infrastructure
Your role involves supporting development of novel thermal structures, executing Multiphysics thermal simulations, validating materials, and collaborating cross-functionally to enhance product performance, reliability, and manufacturability. You will operate with a high degree of autonomy and technical depth to define and drive innovation across mechanical platforms-from early-stage PoCs through NPI handoff
This role is highly cross-functional, requiring collaboration with structural, electrical, signal integrity, system architecture, manufacturing, and supplier development teams.
BU OverviewConsumer, network, and data center applications change at an exponential pace and the Data & Devices (D&D) business unit at TE Connectivity is at the heart of a continuously expanding connected life. Accordingly, we provide responsive, iterative, and fundamentally agile capabilities and conceive, design, and manufacture to support today's demands. Our customers are building the devices and the infrastructure that is redefining what information technology means. Our products push markets and meet the ever-changing needs of the evolving, more connected, data-driven world. We are enhancing how we do business, focusing on the most important things and staying agile and responsive to the needs of a faster, more connected world.
The Mechanical Center of Excellence (ME COE) plays a critical role in shaping the future of thermomechanical design, reliability engineering, and platform-based product development. By integrating advanced mechanical research, simulation, and manufacturability expertise, ME COE empowers faster, more scalable, and more robust innovation across TE's high-speed connectivity and AI infrastructure portfolios.
Main Responsibilities1. Strategy & Architecture - Lead end-to-end multiphysics simulation strategy and method development for thermal performance of complex electro-mechanical systems (connectors, high-speed I/O, enclosures, power-dense assemblies
- Support thermal architecture development, defining heat transfer strategies across conduction, convection, and radiation to meet system-level performance targets.
- Influence product and technology strategy, contributing to roadmaps in data centers, high-speed interconnects, and power delivery systems.
2. Simulation method development & Support on Design Execution for next gen thermal technologies - Translate system-level thermal challenges into physics-based models using FEA/CFD to solve electro-thermal, thermo-mechanical, and fluid-thermal problems under real-world conditions.
- Drive thermal design optimization for high-power-density systems, balancing temperature, pressure drop, signal integrity, and manufacturability.
- Support material and interface strategies (TIMs, high-conductivity alloys, advanced polymers/composites) to ensure performance and reliability under thermal cycling, aging, and environmental stress.
- Establish thermal design standards and best practices, including thermal resistance networks, contact/interface heat transfer, airflow and liquid cooling integration, and thermal distortion/tolerance stack-up effects.
- Standardize methodologies and scalable models to enable reusable simulation frameworks, digital twins, and cross-platform design libraries.
- Support innovation in next-generation cooling solutions, including liquid cooling, co-packaged optics integration, high-current connector thermal management, and AI-driven optimization.
3. Cross-Functional Integration - Collaborate with electrical (SI/PI), mechanical, and manufacturing teams to co-optimize system performance, packaging density, and thermal solutions.
4. Validation, & Governance - Lead thermal model validation and correlation through lab testing (IR thermography, thermocouples, wind tunnel), model calibration, and development of design margins and derating guidelines.
- Support design governance and technical reviews (DFMEA, PFMEA), ensuring robust multiphysics considerations in product decisions.
5. Leadership & External Engagement - Mentor engineers and build domain expertise in thermal sciences, multiphysics simulation, and physics-based design.
- Represent the organization externally with customers, industry forums, and standards bodies on advanced thermal challenges.
What your background should look likeRequired Skills/Experience:- Bachelor's degree in Mechanical Engineering or Physics with 12+ years of experience, or Master's with 10+ years of experience, or PhD with 6+ years of experience, or equivalent amount of experience in mechanical product development in connector, electronics, or high-reliability hardware industries.
- Hands-on experience with mechanical design and modeling using tools such as Creo, SolidWorks, or NX.
- Expertise in simulation tools such as ANSYS, Abaqus, or FloTHERM for thermal/structural analysis.
- Proven experience in DFM, DFA, and transition of mechanical designs to high-volume manufacturing.
- Deep understanding of materials science, including polymers, metals, and thermal materials.
- Experience conducting reliability testing: thermal cycling, vibration, drop/shock, and HALT/HASS.
- Strong problem-solving and analytical skills with a focus on root cause analysis and continuous improvement.
- Excellent communication skills to engage with global engineering, operations, and customer teams
Nice to have Skills/Experience:- Ph.D. in Engineering or equivalent.
- Experience with micro-mechanics, co-packaged optics, or liquid cooling solutions.
- Familiarity with data analytics, Six Sigma methodologies, or AI-driven simulation optimization.
- Experience working on system-level hardware such as AI servers, switches, or RF modules.
- Patent filings or published research in mechanical design, thermal management, or materials.
- Experience managing cross-functional or global engineering projects
#LI-REMOTE
CompetenciesSET : Strategy, Execution, Talent (for managers)
COMPENSATION- Competitive base salary commensurate with experience: $154,100 - $231,100 (subject to change dependent on physical location)
- Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
- Total Compensation = Base Salary + Incentive(s) + Benefits
Job Locations:United States
Posting City: #
Job Country: United States
Travel Required: 10% to 25%
Requisition ID: 144191
Workplace Type: Remote
External Careers Page: Engineering & Technology
